MT48LC32M16A2P-75:C Micron Technology Inc, MT48LC32M16A2P-75:C Datasheet - Page 25

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MT48LC32M16A2P-75:C

Manufacturer Part Number
MT48LC32M16A2P-75:C
Description
DRAM Chip SDRAM 512M-Bit 32Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r
Datasheet

Specifications of MT48LC32M16A2P-75:C

Density
512 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Organization
32Mx16
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
115mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
512M (32Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
54-TSOP (0.400", 10.16mm Width)
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Manufacturer
Quantity
Price
Part Number:
MT48LC32M16A2P-75:C
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MICRON
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Figure 13:
Figure 14:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
READ-to-WRITE
READ-to-WRITE with Extra Clock Cycle
Note:
Note:
The DQM signal must be de-asserted prior to the WRITE command (DQM latency is
zero clocks for input buffers) to ensure that the written data is not masked. Figure 13
shows the case where the clock frequency allows for bus contention to be avoided
without adding a NOP cycle, and Figure 14 shows the case where the additional NOP is
needed.
COMMAND
COMMAND
A fixed-length READ burst may be followed by, or truncated with, a PRECHARGE
command to the same bank (provided that auto precharge was not activated), and a full-
page burst may be truncated with a PRECHARGE command to the same bank. The
PRECHARGE command should be issued x cycles before the clock edge at which the last
desired data element is valid, where x = CL - 1. This is shown in Figure 15 on page 26 for
ADDRESS
ADDRESS
A CL = 3 is used for illustration. The READ command may be to any bank, and the WRITE
command may be to any bank. If a burst of 1 is used, then DQM is not required.
CL = 3 is used for illustration. The READ command may be to any bank, and the WRITE
command may be to any bank.
DQM
DQM
CLK
CLK
DQ
DQ
BANK,
T0
COL n
BANK,
COL n
READ
T0
READ
T1
T1
NOP
NOP
Transitioning Data
25
T2
T2
NOP
NOP
Transitioning Data
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T3
T3
NOP
D
NOP
OUT
t
t HZ
D
HZ
t
n
OUT
CK
n
Don’t Care
BANK,
T4
COL b
WRITE
T4
NOP
D
IN
b
t
512Mb: x4, x8, x16 SDRAM
DS
Don’t Care
T5
BANK,
COL b
WRITE
D
IN
b
t
©2000 Micron Technology, Inc. All rights reserved.
DS
Operations

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