SILICON GREASE 8 OZ JAR

120-8

Manufacturer Part Number120-8
DescriptionSILICON GREASE 8 OZ JAR
ManufacturerWakefield Thermal Solutions
Series120
TypeSilicon Compound
120-8 datasheets
 


Specifications of 120-8

Size / Dimension8 oz JarDispensing MethodJar
Weight8ozTrade Name, Chemical120 Series
FeaturesExcellent Thermal Resistance Of Only 0.05°C/W For A 0.001 In. Film With An Area Of One Square Inch.ColorWhite
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names345-1009
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THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
120 SERIES
The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces
with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
resistance of only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable
increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period
(Time versus Thermal Resistivity graph below).
Case Style Characteristics
T0-3
TO-66
TO-220
0.19 (4.8) stud x 0.44 (11.2) hex
0.25 (6.4) stud x 0.69 (17.5) hex
0.38 (9.7) stud x 1.06 (26.9) hex
0.50 (12.7) stud x 1.06 (26.9) hex
0.75 (19.1) stud x 1.25 (31.8) hex
126 SERIES
The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide
fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding
that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and
migration of silicone-based products.
Shelf life: 5 years.
Appearance
Solids Content, wt %
Thermal Conductivity at 36°C = 4.8 (Btu)(in.)/(hr) (ft
Interface Thermal Resistance
Bleed, 24 hrs at 200°C, wt%
Evaporation, 24 hrs at 200°C, wt%
Volume Resistivity
Dielectric Strength
Specific Gravity @ 60°F
Penetration
Operating Range
Normally stocked
TYPICAL VALUES FOR THERMAL RESISTANCE,
CASE TO SINK (Ø cs ) WHEN THERMAL JOINT
COMPOUNDS ARE USED
Typical
Mounting Torque
Thermal
in inch • pounds Resistance
(N•M)
(°C/W)
8 (0.9)
0.09
9 (0.9)
0.14
8 (0.9)
0.50
15 (1.7)
0.16
30 (3.39)
0.10
75 (8.47)
0.07
125 (14.12)
0.07
600 (67.79)
0.052
126 SERIES THERMAL JOINT COMPOUND
Characteristics
2
) (°F)
69
120 SERIES - THERMAL JOINT COMPOUND
Characteristic
Description
5 X 10e 14 ohm/cm
Volume Resistivity
Dielectric Strength
225 volts/mil
Specific Gravity
2.1 min.
Thermal Conductivity @ WC
0.735 W/(m)(K)
5.1(Btu) (in.)/(hr)(ft
Thermal Resistivity (P)
56 (°C)(in.)/watt
Bleed, % after 24 hrs @ 200°C
0.5
Evaporation, % after 24 hrs @ 200°C
0.5
Color
opaque white
Shelf life
5 years
Operating Temperature Range (°C)
-40/+200
120 SERIES - ORDER GUIDE
Series -
Container Size
P/N
120-SA
4 gram plastic pak
120-2
2 oz (0.06 kg) jar
120-5
5 oz (0.14 kg) tube
120-8
8 oz (0.23 kg) jar
120-80
5 lb (2.27 kg) can
120-320
20 lb (9.08 kg) can
126 SERIES - ORDER GUIDE
Series -
Description
P/N
Smooth, white homogeneous paste
126-2
65% min
126-4
19.0 X 10e 4 cal/sec cm °C, min
126-4S
4 oz (0.11 kg) syringe
0.043°C/W TO-3 at 0.0008 thick film
126-5LB
0.09% max
0.6 max
2.3 x 10e 12 ohms/cm
200 volts/mil
2.93 (gm/cc)
280 to 320
-40°C to 200°C
All other products, please contact factory for price, delivery, and minimums.
Accessory
Products
2
)(°F)
Container Size
2 oz (0.6 kg) jar
4 oz (0.11 kg) tube
5 lb (2.27 kg) can

120-8 Summary of contents

  • Page 1

    ... SERIES - ORDER GUIDE Series - Container Size P/N 120-SA 4 gram plastic pak 120 (0.06 kg) jar 120 (0.14 kg) tube 120 (0.23 kg) jar 120- (2.27 kg) can 120-320 20 lb (9.08 kg) can 126 SERIES - ORDER GUIDE Series - Description P/N Smooth, white homogeneous paste 126-2 65% min 126-4 19.0 X 10e 4 cal/sec cm ° ...

  • Page 2

    Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to DeltaBond™ 152 chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal ...

  • Page 3

    THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaCast™ 153 is a pourable casting resin having thermal expansion characteristics similar to aluminum and DeltaCast™ 153 copper allowing assemblies to operate over a very wide temperature range. Ideal for encapsulating components and assemblies, ...

  • Page 4

    Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS DeltaBond™ 155 DeItaBond™ 155 is an epoxy adhesive formulated for use within the semiconductor industry. An easy to mix spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient ...

  • Page 5

    THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 173/174 SERIES 175 SERIES Characteristics Material Thickness Color Tear Strength, lb/in. Typical The 173, 174, and 175 Volume Resistivity, megohm-cm, Minimum Normal Series are highly Breakdown Voltage, Minimum efficient thermally conductive insulators Dielectric Constant ...