BK32164M471-T Taiyo Yuden, BK32164M471-T Datasheet - Page 18

• Manufacturer Part Number: BK32164M471-T
• Description: FERRITE BEAD 470OHM 1206
• Manufacturer: Taiyo Yuden
• Series: BKr

Specifications of BK32164M471-T

• Package / Case: 1206 (3216 Metric)
• Mounting Type: Surface Mount
• Current Rating: 150mA
• Filter Type: Differential Mode - 4 Line Array
• Dc Resistance (dcr): 500.0 mOhm Max
• Number Of Lines: 4
• Impedance @ Frequency: 470 Ohm @ 100MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

mlci0109_reli-PRP13
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Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
＊ This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification.
1. Circuit Design
2. PCB Design
Precautions
Precautions
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
◆Verification of operating environment, electrical rating and performance
◆Operating Current （Verification of Rated current）
◆Pattern configurations （ Design of Land-patterns）
◆Pattern configurations （ Inductor layout on panelized ［breakaway］ PC boards）
◆Pattern configurations （ Design of Land-patterns）
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications.
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used （ size of fillet） can directly affect inductor performance.
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting,
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts （ larger fillets which extend above
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated
（2） Examples of good and bad solder application
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from
components used in general purpose applications.
board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.） For this reason, planning pattern
configurations and the position of SMD inductors should be carefully performed to minimize stress.
the component end terminations） . Examples of improper pattern designs are also shown.
Therefore, the following items must be carefully considered in the design of solder land patterns:
designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of
solder necessary to form the fillets.
by solder-resist.
smaller than terminal electrode of chips.
Recommended land dimensions for wave-soldering
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.
components near mounted
Type
Hand-soldering of leaded
Mixed mounting of SMD
and leaded components
Component placement
B
C
A
Horizontal component
close to the chassis
W
L
components
placement
0.8～1.0 1.0～1.4 1.8～2.5
0.5～0.8 0.8～1.5 0.8～1.7
0.6～0.8 0.9～1.2 1.2～1.6
1608
1.6
0.8
Item
2125
1.25
2.0
（Unit：mm）
3216
3.2
1.6
Not recommended
Recommended land dimensions for reflow-soldering
Recommended land dimension for Reflow-soldering
Type
A
B
C
Type
W
L
b
d
a
c
W
L
0.20～0.30 0.45～0.55 0.50～0.55 0.6～0.8 0.8～1.2 0.8～1.2 0.8～1.2 1.8～2.5 1.0～1.4
0.20～0.30 0.40～0.50 0.30～0.40 0.6～0.8 0.8～1.2 0.8～1.2 0.8～1.2 0.6～1.5 0.6～1.0
0.25～0.40 0.45～0.55 0.60～0.70 0.6～0.8 0.9～1.6 0.9～1.6 1.2～2.0 1.2～2.0 1.8～2.2
Recommended
0603
0.6
0.3
0.7～0.9
0.8～1.0
0.4～0.5
3216
3.2
1.6
0.8
1005
1.0
0.5
（Unit：mm）
1
0.5～0.6
0.5～0.6
0.2～0.3
2010
2.0
1.0
0.5
105
1.0
0.6
1608
1.6
0.8
2012
1.25
2.0
2125
1.25
2.0
2016
2.0
1.6
3216
3.2
1.6
mlci0109_reli_e-01
（Unit：mm）
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2520
2.5
2.0