BK32164M471-T Taiyo Yuden, BK32164M471-T Datasheet - Page 20

• Manufacturer Part Number: BK32164M471-T
• Description: FERRITE BEAD 470OHM 1206
• Manufacturer: Taiyo Yuden
• Series: BKr

Specifications of BK32164M471-T

• Package / Case: 1206 (3216 Metric)
• Mounting Type: Surface Mount
• Current Rating: 150mA
• Filter Type: Differential Mode - 4 Line Array
• Dc Resistance (dcr): 500.0 mOhm Max
• Number Of Lines: 4
• Impedance @ Frequency: 470 Ohm @ 100MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
＊ This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification.
4. Soldering
Precautions
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
◆Selection of Flux
◆Soldering
◆And please contact us about peak temperature when you use lead-free paste.
◆Selection of Flux
◆Soldering
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect
1-1. When too much halogenated substance （ Chlorine, etc.） content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue
1-1. Preheating when soldering
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong acidity content should
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
［Reflow soldering］
［Wave soldering］
［Hand soldering］
after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor.
solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines
used should also be considered carefully when selecting water-soluble flux.
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be
conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
Temperature profile
Caution
Temperature profile
Caution
Temperature profile
Caution
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
2. The soldering iron should not directly touch the inductor.
1. The ideal condition is to have solder mass （ fillet） controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below:
1. Make sure the inductors are preheated sufficiently.
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
not be applied.
Temperature （ ℃）
Temperature （ ℃）
Temperature （ ℃）
Temperature （ ℃）
Temperature （ ℃）
Temperature （ ℃）
Temperature （ ℃）
Temperature （ ℃）
Temperature （ ℃）
300
300
400
300
300
300
200
100
300
200
400
300
200
100
300
200
200
100
400
300
200
200
100
200
100
100
200
100
100
100
0
0
0
0
0
0
0
0
0
（※⊿ ＴT190℃ （3216Type max） , ⊿ Ｔ ≦130℃ （3225
（※⊿ ＴT190℃ （3216Type max） , ⊿ Ｔ ≦130℃ （3225
（※⊿ ＴT190℃ （3216Type max） , ⊿ Ｔ ≦130℃ （3225
※Ceramic chip components should be preheated to
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
※Ceramic chip components should be preheated to
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
※It is recommended to use 20W soldering iron and
※The soldering iron should not directly touch the
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
※It is recommended to use 20W soldering iron and
※The soldering iron should not directly touch the
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
※Ceramic chip components should be preheated to
※Assured to be reflow soldering for 2 times.
※Ceramic chip components should be preheated to
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
※It is recommended to use 20W soldering iron and
※The soldering iron should not directly touch the
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
Type ming）
Type ming）
Type ming）
components.
components.
components.
within 100 to 130℃ of the soldering.
within 100 to 130℃ of the soldering.
the tip is 1φ or less.
the tip is 1φ or less.
within 100 to 130℃ of the soldering.
within 100 to 130℃ of the soldering.
within 100 to 130℃ of the soldering.
the tip is 1φ or less.
within 100 to 130℃ of the soldering.
soldering condition, therefore these profiles are
not always recommended.
soldering condition, therefore these profiles are
not always recommended.
soldering condition, therefore these profiles are
not always recommended.
Preheating
Preheating
Preheating
120 sec min
120 sec min
120 sec min
Peak 260℃ max
Peak 260℃ max
Peak 260℃ max
Peak 260℃ max
Peak 260℃ max
Peak 260℃ max
150℃
150℃
150℃
10 sec max
10 sec max
10 sec max
10 sec max
10 sec max
10 sec max
60 sec min
Preheating
60 sec min
Preheating
60 sec min
Preheating
150℃
150℃
150℃
60 sec min
60 sec min
60 sec min
⊿ Ｔ
⊿ Ｔ
⊿ Ｔ
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
（Pb free soldering）
1
Heating above 230℃
Heating above 230℃
Heating above 230℃
40 sec max
40 sec max
40 sec max
350℃ max
350℃ max
3 sec max
350℃ max
3 sec max
Gradually
Gradually
3 sec max
Gradually
Gradually
Gradually
Gradually
Gradually
Gradually
Gradually
cooling
cooling
cooling
cooling
cooling
cooling
cooling
cooling
cooling
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