BK32164M471-T Taiyo Yuden, BK32164M471-T Datasheet - Page 21

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BK32164M471-T

Manufacturer Part Number
BK32164M471-T
Description
FERRITE BEAD 470OHM 1206
Manufacturer
Taiyo Yuden
Series
BKr
Datasheets

Specifications of BK32164M471-T

Package / Case
1206 (3216 Metric)
Mounting Type
Surface Mount
Current Rating
150mA
Filter Type
Differential Mode - 4 Line Array
Dc Resistance (dcr)
500.0 mOhm Max
Number Of Lines
4
Impedance @ Frequency
470 Ohm @ 100MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BK32164M471-T
Manufacturer:
TAIYO/太诱
Quantity:
20 000
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
* This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification.
mlci0109_reli_e-01
5. Cleaning
6. Post cleaning processes
7. Handling
8. Storage conditions
Precautions
Precautions
Precautions
Precautions
Technical
consider-
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
ations
◆Cleaning conditions
◆Cleaning conditions
◆Application of resin coatings, moldings, etc. to the PCB and components.
◆Breakaway PC boards ( splitting along perforations)
◆General handling precautions
◆Mechanical considerations
◆Storage
◆Storage
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics.
2. Inappropriate cleaning conditions ( insufficient or excessive cleaning) may detrimentally affect the performance of the inductors.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
2. Board separation should not be done manually, but by using the appropriate devices.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors (soldering irons, measuring instruments) should be properly grounded.
5. Keep bare hands and metal products ( i.e., metal desk) away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal
The use of such resins, molding materials etc. is not recommended.
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the
1. Always wear static control bands to protect against ESD.
1. Be careful not to subject the inductors to excessive mechanical shocks.
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
(1) Excessive cleaning
(1) If inductors are dropped on the floor or a hard surface they should not be used.
(2) When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.
the cleaning ( e.g. to remove soldering flux or other materials from the production process.)
electrical properties ( especially insulation resistance) .
storage conditions resulting in the deterioration of the inductor's performance.
damage or destruction.
board.
humidity in the storage area. Humidity should especially be kept as low as possible.
The ambient temperature must be kept below 30℃. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so
inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the inductors.
Recommended conditions
Ambient temperature
Humidity
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor
or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;
Ultrasonic output
Ultrasonic frequency
Ultrasonic washing period
Below 40℃
Below 70% RH
Below 20W/ℓ
Below 40kHz
5 min. or less
1
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