BK32164M471-T Taiyo Yuden, BK32164M471-T Datasheet - Page 19

• Manufacturer Part Number: BK32164M471-T
• Description: FERRITE BEAD 470OHM 1206
• Manufacturer: Taiyo Yuden
• Series: BKr

Specifications of BK32164M471-T

• Package / Case: 1206 (3216 Metric)
• Mounting Type: Surface Mount
• Current Rating: 150mA
• Filter Type: Differential Mode - 4 Line Array
• Dc Resistance (dcr): 500.0 mOhm Max
• Number Of Lines: 4
• Impedance @ Frequency: 470 Ohm @ 100MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
＊ This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification.
mlci0109_reli_e-01
2. PCB Design
3. Considerations for automatic placement
Precautions
Technical
consider-
Technical
consider-
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
ations
◆Pattern configurations （ Inductor layout on panelized ［breakaway］ PC boards）
◆Adjustment of mounting machine
◆Selection of Adhesives
◆Adjustment of mounting machine
◆Selection of Adhesives
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board
2. The maintenance and inspection of the mounter should be conducted periodically.
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC
（1） Required adhesive characteristics
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too
factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is
imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.
inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the
pin should be conducted periodically.
result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component
placement, so the following precautions should be noted in the application of adhesives.
considered before lowering the pick-up nozzle:
warp or deflection.
An example below should be counted for better design.
methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must
also consider the PCB splitting procedure.
［Recommended conditions］
Deflection of the board
board. The following diagrams show some typical examples of good pick-up nozzle placement:
little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive
flow of adhesive on to the land or solder pad.
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
d. The adhesive should be used during its prescribed shelf life.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
c. The adhesive should have good coating and thickness consistency.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
Double-sided mounting
Single-sided mounting
Item
Item
Not recommended
Improper method
Recommended
Figure
a
b
c
Proper method
1
0805 case sizes as examples
Area with no adhesive
100～120μm
0.3mm min
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