NFL21SP506X1C3D Murata Electronics North America, NFL21SP506X1C3D Datasheet - Page 144

FILTER LC HIGH FREQ 84PF 0805

NFL21SP506X1C3D

Manufacturer Part Number
NFL21SP506X1C3D
Description
FILTER LC HIGH FREQ 84PF 0805
Manufacturer
Murata Electronics North America
Series
EMIFIL®, NFL21SPr

Specifications of NFL21SP506X1C3D

Center / Cutoff Frequency
50MHz
Voltage
16V
Current
150mA
Capacitance
84pF
Filter Type
Low Pass
Package / Case
0805 (2012 Metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Impedance
-
Attenuation Value
-
Other names
490-2542-2
NFM2012K04F506T1

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NFL21SP506X1C3D
Manufacturer:
MURATA/村田
Quantity:
20 000
!Note
142
NFW31S
NFE31P
NFE61P
NFA
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
150-200 m
150-200 m
0.25
NFA21S
NFA18S
NFA31G/31C
0.175
0.5
0.05
Solder Paste Printing
0.3
1.5
0.25
1.375
1.3
2.0
0.4
1.5
4.8
8.8
0.5
2.6
0.6
2.2
4.2
0.225
0.8 Pitch
0.6
Apply 1.0mg of bonding agent at each chip.
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
NFp Chip EMIFILr
Bonding agent
Bonding agent
Adhesive Application
Soldering and Mounting
Bonding agent
1.5
4.8
9.0
Coating positon of
bonding agent
(in mm)
Mar.28,2011
C31E.pdf

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