NFL21SP506X1C3D Murata Electronics North America, NFL21SP506X1C3D Datasheet - Page 199

• Manufacturer Part Number: NFL21SP506X1C3D
• Description: FILTER LC HIGH FREQ 84PF 0805
• Manufacturer: Murata Electronics North America
• Series: EMIFIL®, NFL21SPr

Specifications of NFL21SP506X1C3D

• Center / Cutoff Frequency: 50MHz
• Voltage: 16V
• Current: 150mA
• Capacitance: 84pF
• Filter Type: Low Pass
• Package / Case: 0805 (2012 Metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Impedance: -
• Attenuation Value: -
• Other names: 490-2542-2; NFM2012K04F506T1

BNX
o
!Note
1. Standard Land Pattern Dimensions
BNX022
BNX023
BNX024
BNX025
2. Solder Paste Printing and Adhesive Application
BNX022
BNX023
BNX024
BNX025
PCB Warping (for BNX02p)
When reflow soldering the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
Block Type EMIFILr
oGuideline of solder paste thickness:
12.5
10.2
9.9
9.6
7.1
6.2
5.3
2.8
2.3
150-200 m
0
block type
12.5
10.2
9.6
7.1
5.3
2.8
2.3
0
PSG
Solder Paste Printing
PSG
B
B
EMIFILr, the
CG
CG
CG
SMD Type
CG
CB
CG
CB
CG
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
(1) A double-sided print board (or multilayer board) as shown in
(2) This product has large rated current of 10A/15A. Please
(3) Please drop CG on a ground electrode on the back layer
(4) It is recommended to use a double-sided printed circuit
(5) The ground pattern should be designed to be as large as
Poor example
the left figure is designed, and please apply a soldering Cu
electrode with a product electrode to a "Land Pattern", apply
resist to a "Land Pattern + Solder Resist" at Cu electrode.
consider real current and make Cu electrode thick enough.
(Please design line resistance suitable for real current)
(the same also in a multilayer case) by the through hole. And
a surface grand electrode layer may also take a large area
as much as possible.
board with BNX mounting on one side and the ground
pattern on the other in order to maximize filtering
performance, multiple feed through holes are required to
maximize the BNX's connection to ground.
possible to achieve maximum filtering performance.
Soldering and Mounting
Adhesive Application
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
Good example
b
a
(in mm)
197
Mar.28,2011
C31E.pdf