NFL21SP506X1C3D Murata Electronics North America, NFL21SP506X1C3D Datasheet - Page 95

• Manufacturer Part Number: NFL21SP506X1C3D
• Description: FILTER LC HIGH FREQ 84PF 0805
• Manufacturer: Murata Electronics North America
• Series: EMIFIL®, NFL21SPr

Specifications of NFL21SP506X1C3D

• Center / Cutoff Frequency: 50MHz
• Voltage: 16V
• Current: 150mA
• Capacitance: 84pF
• Filter Type: Low Pass
• Package / Case: 0805 (2012 Metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Impedance: -
• Attenuation Value: -
• Other names: 490-2542-2; NFM2012K04F506T1

(1) Soldering Methods
(2) Soldering Profile
!Note
3. Standard Soldering Conditions
oReflow Soldering Profile
oFlow Soldering profile
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
ferrite beads.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
(Sn-3.0Ag-0.5Cu Solder)
( Sn-3.0Ag-0.5Cu Solder)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
BLM (Except BLM02/03/15/18G)
BLA31
BLM
BLA
solder will deteriorate performance of products.
If using BLA series with Sn-Zn based solder,
please contact Murata in advance.
Series
Series
220 C min.
Temp. (T1)
Temp. (T1)
150 C
180
150
Heating
T1
Pre-heating
30 to 60s
Time. (t1)
Standard Profile
Time. (t1)
60s min.
Pre-heating
Pre-heating
90s 30s
t1
Temperature
T3
T2
T2
T1
245 3 C
Peak
Temp. (T2)
(T2)
Heating
250 C
t1
t2
t2
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
Heating
Standard Profile
of Reflow
Time (s)
Time (s)
2 times
In case of using RA type solder, products should be
cleaned completely with no residual flux.
exceeding 0.20wt%)
Cycle
T4
T3
max.
Time. (t2)
4 to 6s
BLp Chip Ferrite Bead
Limit Profile
Standard Profile
Limit Profile
Standard Profile
230 C min.
Temp. (T3)
2 times
of Flow
Cycle
max.
Heating
60s max.
Time. (t2)
Temp. (T3)
265 3 C
Limit Profile
Heating
Temperature
Soldering and Mounting
260 C/10s
Limit Profile
Time. (t2)
Peak
5s max.
(T4)
of Reflow
2 times
Cycle
of Flow
2 times
max.
Cycle
max.
93
Mar.28,2011
C31E.pdf