NFL21SP506X1C3D Murata Electronics North America, NFL21SP506X1C3D Datasheet - Page 96

• Manufacturer Part Number: NFL21SP506X1C3D
• Description: FILTER LC HIGH FREQ 84PF 0805
• Manufacturer: Murata Electronics North America
• Series: EMIFIL®, NFL21SPr

Specifications of NFL21SP506X1C3D

• Center / Cutoff Frequency: 50MHz
• Voltage: 16V
• Current: 150mA
• Capacitance: 84pF
• Filter Type: Low Pass
• Package / Case: 0805 (2012 Metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Impedance: -
• Attenuation Value: -
• Other names: 490-2542-2; NFM2012K04F506T1

BLp Chip Ferrite Bead
!Note
94
(3) Reworking with Solder Iron
(1) Cleaning Temperature: 60 C max. (40 C max. for
(2) Ultrasonic
(3) Cleaning Agent
(1) Die Bonding Mounting
(a) Dimension of Standard Metal Mask
4. Cleaning
5. Mounting of BLM15_AN1 Series
The following conditions must be strictly followed when
using a soldering iron.(Except BLM02 Series)
Pre-heating: 150 C 60s min.
Soldering iron power output / Tip diameter:
Following conditions should be observed when cleaning
chip ferrite beads.
alcohol type cleaner)
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
BLM15_AN1 is series for wire bonding mounting.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
80W max. / ø3mm max.
0.7
Soldering and Mounting
Chip Ferrite Bead
Metal thickness: 50 m
(in mm)
(4) Ensure that flux residue is completely removed.
(5) BLM_G type is processed with resin. On rinsing the
(b) Die Bonding Agent
o Use adhesive for die bonding for which the curing
(c) Notice
o Use a flat surface of substrate for bonding mounting.
o Adhesive for die bonding may affect the mounting
Temperature of soldering iron tip / Soldering time / Times:
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
(a) Alcohol cleaning agent
(b) Aqueous cleaning agent
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
product, using water for ultrasonic cleaning may affect
the resin quality used for the product by water element. In
case of set cleaning conditions, please make sure the
reliability according to the cleaning conditions.
temperature is 200 C or less.
Slant mounting of product may affect the wire bonding.
reliability in wire bonding.
Make sure of the mounting reliability with the adhesive to
be used in advance.
Isopropyl alcohol (IPA)
Pine Alpha ST-100S
350 C max. / 3-4s / 2 times
Mar.28,2011
C31E.pdf