MT47H128M16HG-3 IT:A Micron Technology Inc, MT47H128M16HG-3 IT:A Datasheet - Page 21

• Manufacturer Part Number: MT47H128M16HG-3 IT:A
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H128M16HG-3 IT:A

• Organization: 128Mx16
• Address Bus: 17b
• Access Time (max): 4.5ns
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 275mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Figure 10: 60-Ball FBGA Package (11.5mm x 14mm) – x4, x8
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.33 NSMD
ball pads.
Seating
60X Ø0.45
plane
0.12 A
8 CTR
0.8 TYP
A
Notes:
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
0.8 TYP
11.5 ±0.15
6.4 CTR
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.1
21
Ball A1 ID
14 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR2 SDRAM
1.2 MAX
Ball A1 ID
© 2006 Micron Technology, Inc. All rights reserved.
Packaging