MT47H256M8HG-37E:A Micron Technology Inc, MT47H256M8HG-37E:A Datasheet - Page 109

• Manufacturer Part Number: MT47H256M8HG-37E:A
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H256M8HG-37E:A

• Organization: 256Mx8
• Address Bus: 18b
• Access Time (max): 500ps
• Maximum Clock Rate: 533MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 150mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Figure 62: WRITE-to-READ
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Command
DQS, DQS#
DQS, DQS#
DQS, DQS#
t DQSS (NOM)
t DQSS (MIN)
t DQSS (MAX)
Address
CK#
DM
DM
DM
DQ
DQ
DQ
CK
WRITE
Bank a,
Col b
T0
WL - t DQSS
Notes:
WL ± t DQSS
WL + t DQSS
NOP
T1
1.
2. Subsequent rising DQS signals must align to the clock within
3. DI b = data-in for column b; DO n = data-out from column n.
4. BL = 4, AL = 0, CL = 3; thus, WL = 2.
5. One subsequent element of data-in is applied in the programmed order following DI b.
6.
7. A10 is LOW with the WRITE command (auto precharge is disabled).
8. The number of clock cycles required to meet
t
quired between module ranks.
t
greater.
DI
b
WTR is required for any READ following a WRITE to the same device, but it is not re-
WTR is referenced from the first positive CK edge after the last data-in pair.
NOP
T2
DI
b
DI
b
T2n
2
NOP
T3
2
2
T3n
NOP
T4
109
t WTR 1
T5
NOP
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Bank a,
2Gb: x4, x8, x16 DDR2 SDRAM
READ
T6
Col n
t
WTR is either 2 or
CL = 3
CL = 3
CL = 3
T7
NOP
Transitioning Data
© 2006 Micron Technology, Inc. All rights reserved.
t
DQSS.
t
WTR/
T8
NOP
t
CK, whichever is
T9
NOP
Don’t Care
WRITE
DI
DI
DI
T9n