SRF 55V10P C Infineon Technologies, SRF 55V10P C Datasheet - Page 4

• Manufacturer Part Number: SRF 55V10P C
• Manufacturer: Infineon Technologies

Specifications of SRF 55V10P C

• Operating Temperature (max): 70C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

Development Tool
―
1
Table 1:
For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local
Infineon sales office.
Pin Description
Figure 1: Pin Configuration Module Contactless Card – MFCC1 (top / bottom view)
Figure 2: Pin Configuration Module Contactless Card – MCC2 (top view)
1)
2)
Short Product Information
Type
SRF 55V10P C
SRF 55V10P NB
SRF 55V10P MFCC1 S-MFCC1-2-1
SRF 55V10P MCC2
Available as a Module Flip Chip Contactless (MFCC1), Module Contactless Card (MCC) for embedding in plastic
cards, as NiAu-bump version (NB) or as a die on sawn / unsawn wafer for customer packaging
FCoS™ Flip Chip on Substrate
my-d
®
Ordering and Packaging information
Evaluation Kit including my-d
Ordering Information
Package
Sawn wafer
NiAu bump wafer
P-MCC2-2-1
1)
®
2)
Manager Software
1024 bytes 256 bytes
4 / 9
User
Memory
Admin.
Pages
my-d
128
®
Ordering Code
SP000009362
SP000294241
SP000010035
SP000009365
vicinity plain
SRF 55V10P
2007-07-02