TC6387XB Toshiba, TC6387XB Datasheet - Page 17

• Manufacturer Part Number: TC6387XB
• Manufacturer: Toshiba

Specifications of TC6387XB

• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

4.5 Interruption
4.5.1 SD card insertion interrupt by #SDCD
+ Interrupt Assert Condition
+ Factor Evaluation Method
+De-asserting Method
4.5.2 SD card removal interrupt by #SDCD
+ Interrupt Assert Condition
When the TC6387XB detects the each interrupt sources, TC6387XB asserts interrupt signals (#HINT). It is necessary
that the interrupt mask bits are released. This mask bits releasing is controlled by setting SD Interrupt Mask
Register(Offset:020-023h, 120-123h). Each factor of the interrupt can be evaluated by referring to SD Card Status
Register(Offset:01C-01Dh, 11C-11Dh) or SD Buffer Control & Error Status Register(Offset:01E-01Fh, 11E-11Fh).
The details of each factor are listed below.
TOSHIBA CONFIDENTIAL
(1) "0" is written into the SCIN bit(D4) of SD Card Status Register(Offset:01C-01Dh).
(2) "1" is written into the MCIN bit(D4) of SD Interrupt Mask Register(Offset:020-023h).
(3) Hardware reset by #PCLR = “0”.
(4) Software reset by writing "0" into the SRST bit(D0) of SD Software Reset Register(Offset:0E0h).
When an SD card is inserted to a slot, #SDCD is lowered. This condition causes an interrupt to be generated.
#SDCD is not recognized as being lowered unless it remains in "0" state for the number of HCLK cycles specified
by CDM[1:0] of Card Detect Mode Register(Config Offset:4Ch). The interrupt is asserted in th timing of raising of
CLK32 from #SDCD low state.
When an SD card in a slot is removed, #SDCD is raised. This condition causes an interrupt to be generated. After
#SDCD is high, the interrupt is asserted in th timing of raising of CLK32.
The SCIN bit(D4) of SD Card Status Register(Offset:01C-01Dh) is set to "1".
#SDCD
CLK32
#HINT
HCLK
CDM
TC6387XB Specification
TOTAL
62
Rev. 1.0 02/02/06
PAGE NO.17