SRF 55V10P MCC2 Infineon Technologies, SRF 55V10P MCC2 Datasheet

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SRF 55V10P MCC2

Manufacturer Part Number
SRF 55V10P MCC2
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of SRF 55V10P MCC2

Mounting
Surface Mount
Pin Count
2
Lead Free Status / RoHS Status
Compliant
Chip Card & Security ICs
®
my-d
vicinity
SRF 55V10P
Intelligent 10 Kbit EEPROM
with Contactless Interface compliant to ISO/IEC 15693
and ISO/IEC 18000-3 mode 1
Plain Mode Operation
Short Product Information
July 2007

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SRF 55V10P MCC2 Summary of contents

Page 1

Chip Card & Security ICs ® my-d vicinity SRF 55V10P Intelligent 10 Kbit EEPROM with Contactless Interface compliant to ISO/IEC 15693 and ISO/IEC 18000-3 mode 1 Plain Mode Operation Short Product Information July 2007 ...

Page 2

... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...

Page 3

Intelligent 10 Kbit EEPROM with Contactless Interface (ISO/IEC 15693 and ISO/IEC 18000-3 mode 1) Features Contactless Interface • Physical Interface and Anticollision compliant to ISO/IEC 15693 and ISO/IEC 18000-3 mode 1 contactless transmission of data and supply energy — carrier ...

Page 4

... SRF 55V10P C Sawn wafer SRF 55V10P NB NiAu bump wafer SRF 55V10P MFCC1 S-MFCC1-2-1 SRF 55V10P MCC2 P-MCC2-2-1 For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local Infineon sales office. Pin Description Figure 1: Pin Configuration Module Contactless Card – MFCC1 (top / bottom view) Figure 2: Pin Configuration Module Contactless Card – ...

Page 5

L A Figure 3: Pad Configuration Die Table 2 Pin Definitions and Functions Symbol Function L Antenna connection A L Antenna connection B Short Product Information ® m y-d vicinity SRF 55V10P ® my-d vicinity plain SRF ...

Page 6

The my-d products are designed to meet increased demands for security and design flexibility. The family of contactless memory my-d incorporates security features to enable considerable flexibility in the application design. The functional architecture, ...

Page 7

SRF 55V10P my-d ® All my-d vicinity products comply with ISO/IEC 18000-3 mode 1 or ISO/IEC 15693 standards for contactless vicinity smart cards. The power supply and data are transferred to the my-d ® via an antenna. The my-d ...

Page 8

Memory Principle The User Memory is built up with up to 248 blocks of 4 bytes each. Individual block locking allows the user to protect the stored data. The service area contains the UID and manufacturer data. The service ...

Page 9

System Overview The system consists of a contactless label and a contactless reader together with an antenna. The transponder is powered by the high frequency field generated by the VCD (Vicinity Coupling Device). Host System µC Identification Terminal (VCD) ...

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