MT18HTF25672FDY-667E1D4 Micron Technology Inc, MT18HTF25672FDY-667E1D4 Datasheet
MT18HTF25672FDY-667E1D4
Specifications of MT18HTF25672FDY-667E1D4
Related parts for MT18HTF25672FDY-667E1D4
MT18HTF25672FDY-667E1D4 Summary of contents
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... PDF: 09005aef81a2f237 htf18c128_256x72fdy.pdf - Rev. D 12/09 EN Products and specifications discussed herein are subject to change by Micron without notice. 1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM Figure 1: 240-Pin FBDIMM (MO-256 R/C B) Module height: 30.35mm (1.19in) Options • Package – 240-pin DIMM (Pb-free) • Frequency/CAS latency – ...
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... Data sheets for the base devices can be found on Micron’s Web page. Notes: 2. All part numbers end with a four-place code (not shown) that designates component, PCB, and AMB revi- sions. Consult factory for current revision codes. Example: MT18HTF25672FDY-667E1D4. PDF: 09005aef81a2f237 htf18c128_256x72fdy.pdf - Rev. D 12/09 EN ...
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Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin FBDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol PN3 PN3 ...
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... M_Test The M_Test pin provides an external connection for testing the margin of V duced by a voltage divider on the module not intended to be used in normal system operation and must not be connected (DNU system. This test pin may have other fea- tures on future card designs and will be included in this specification at that time. ...
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... System Block Diagram Commodity DDR2 DDR2 SDRAM component devices DDR2 component DDR2 component DDR2 component modules AMB • • • DDR2 component DDR2 component DDR2 component DDR2 component SMBus access to buffer registers Micron Technology, Inc. reserves the right to change products or specifications without notice. ...
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Functional Block Diagram Figure 3: Functional Block Diagram CS1# CS0# DQS0 DQS0# DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS1 DQS1# DM5 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQS2 DQS2# DM2 DQ16 DQ17 DQ18 DQ19 DQ20 ...
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... Serial Presence-Detect (SPD) for Fully Buffered DIMM – JEDEC Standard No. 21-C, page 4.1.2.7-1 This DDR2 SDRAM module is a high-bandwidth, large-capacity channel solution that has a narrow host interface. FBDIMM devices use DDR2 SDRAM devices isolated from the channel behind an AMB buffer on the FBDIMM. Memory device capacity remains high, and total memory capacity scales with DDR2 SDRAM bit density ...
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Table 7: I Conditions (Continued) DD Symbol Condition I Training: Primary and secondary channels enabled; 100% toggle on all channel lanes; DD_TRAINING DRAMs idle; 0% bandwidth; CKE HIGH; Command and address lines stable; DDR2 SDRAM clock active I IBIST over ...
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Table 12: I Specifications – 2GB DDR2-667 DD Symbol I DD_IDLE_0 I 2600 CC I 1420 DD Total power 6.8 Table 13: I Specifications – 12B DDR2-800 DD Symbol I DD_IDLE_0 I TBD CC I TBD DD Total power TBD ...
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Table 15: Serial Presence-Detect EEPROM AC Operating Conditions (Continued) Parameter/Condition SDA and SCL rise time SCL clock frequency Data-in setup time Start condition setup time Stop condition setup time WRITE cycle time 1. To avoid spurious start and stop conditions, ...
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... TYP 67.0 (2.638) TYP 66.68 (2.63) Front view with heat spreader U4 U3 Back view with heat spreader U8 U10 U9 additional design dimensions. 11 Module Dimensions 0.75 (0.03 2.0 (0.079) TYP U5 17.3 (0.681) TYP 9.5 (0.374) TYP 3.9 (0.153) TYP (x2) Pin 120 45° ...
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... Although considered final, these specifications are subject to change, as further product development and data characterization some- PDF: 09005aef81a2f237 htf18c128_256x72fdy.pdf - Rev. D 12/09 EN 1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM times occur. 12 Micron Technology, Inc. reserves the right to change products or specifications without notice. Module Dimensions © 2005 Micron Technology, Inc. All rights reserved. ...