MT8HTF12864AY-667E1 Micron Technology Inc, MT8HTF12864AY-667E1 Datasheet

MT8HTF12864AY-667E1

Manufacturer Part Number
MT8HTF12864AY-667E1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT8HTF12864AY-667E1

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240UDIMM
Device Core Size
64b
Organization
128Mx64
Total Density
1GByte
Chip Density
1Gb
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
1.28A
Number Of Elements
8
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / RoHS Status
Compliant
DDR2 SDRAM UDIMM
MT8HTF3264AY – 256MB
MT8HTF6464AY – 512MB
MT8HTF12864AY – 1GB
Features
• 240-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC2-3200, PC2-4200,
• 256MB (32 Meg x 64), 512MB (64 Meg x 64),
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Multiple internal device banks for concurrent
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Serial presence detect (SPD) with EEPROM
• Gold edge contacts
• Single rank
Table 1: Key Timing Parameters
PDF: 09005aef80e2ff8d
htf8c32_64_128x64aypdf - Rev. G 3/10 EN
PC2-5300, PC2-6400, or PC2-8500
or 1GB (128 Meg x 64
operation
Speed
Grade
-1GA
-80E
-800
-667
-53E
-40E
DD
DDSPD
= V
DDQ
= 1.7–3.6V
Nomenclature
= 1.8V
Products and specifications discussed herein are subject to change by Micron without notice.
Industry
PC2-8500
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
256MB, 512MB, 1GB (x64, SR) 240-Pin DDR2 SDRAM UDIMM
CL = 7
1066
t
CK
CL = 6
800
800
800
Data Rate (MT/s)
CL = 5
667
800
667
667
1
Figure 1: 240-Pin UDIMM (MO-237 R/C A and D)
PCB height: 30.0mm (1.18in)
Options
• Operating temperature
• Package
• Frequency/CL
Notes:
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM (lead-free)
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
– 5.0ns @ CL = 3 (DDR2-400)
CL = 4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
533
533
533
553
553
400
1. Contact Micron for industrial temperature
2. CL = CAS (READ) latency.
3. Available only in 1GB, Rev. E devices.
4. Not recommended for new designs.
module offerings.
CL = 3
400
400
400
400
400
400
2
A
13.125
A
t
(ns)
12.5
RCD
≤ +85°C)
≤ +70°C)
15
15
15
15
© 2003 Micron Technology, Inc. All rights reserved.
4
3
1
13.125
(ns)
12.5
t
15
15
15
15
RP
Features
Marking
None
-1GA
-80E
-53E
-40E
-800
-667
58.125
(ns)
57.5
t
Y
I
60
60
55
55
RC

Related parts for MT8HTF12864AY-667E1

MT8HTF12864AY-667E1 Summary of contents

Page 1

... DDR2 SDRAM UDIMM MT8HTF3264AY – 256MB MT8HTF6464AY – 512MB MT8HTF12864AY – 1GB Features • 240-pin, unbuffered dual in-line memory module • Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, PC2-6400, or PC2-8500 • 256MB (32 Meg x 64), 512MB (64 Meg x 64), or 1GB (128 Meg x 64 • ...

Page 2

... Table 2: Addressing Parameter Refresh count Row address Device bank address Device configuration 256Mb (32 Meg x 8) Column address Module rank address Table 3: Part Numbers and Timing Parameters – 256MB Modules (End of Life) 1 Base device: MT47H32M8, 256Mb DDR2 SDRAM Module 2 Part Number Density MT8HTF3264A(I)Y-667__ ...

Page 3

... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT8HTF12864AY-667E1. PDF: 09005aef80e2ff8d htf8c32_64_128x64aypdf - Rev. G 3/10 EN ...

Page 4

Pin Assignments Table 6: Pin Assignments 240-Pin UDIMM Front Pin Symbol Pin Symbol Pin DQ19 61 REF DQ0 33 DQ24 63 4 DQ1 34 DQ25 ...

Page 5

... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 7: Pin Descriptions Symbol Type Ax Input BAx Input ...

Page 6

... SPD EEPROM power supply: 1.7–3.6V. Reference voltage: V /2. DD Ground. No connect: These pins are not connected on the module. No function: These pins are connected within the module, but provide no functionality. Not used: These pins are not used in specific module configurations/operations. Reserved for future use. 6 Pin Descriptions and V ...

Page 7

Functional Block Diagram Figure 2: Functional Block Diagram – Raw Card D S0# DQS0 DQS0 DM0 DQ DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ4 DQ DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DQ DQ8 DQ ...

Page 8

Figure 3: Functional Block Diagram – Alternate Clock S0# DQS0 DQS0 DM0 DQ DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ4 DQ DQ DQ5 DQ DQ6 DQ DQ7 DQS1# DQS1 DM1 DQ DQ8 DQ DQ9 DQ DQ10 DQ ...

Page 9

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 10

... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...

Page 11

... Component specifications are available on Micron's Web site. Module speed grades cor- relate with component speed grades. Table 9: Module and Component Speed Grades DDR2 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1GA ...

Page 12

I Specifications DD Table 10: DDR2 I Specifications and Conditions – 256MB DD Values shown for MT47H32M8 DDR2 SDRAM only and are computed from values specified in the 256Mb (32 Meg x 8) component data sheet Parameter Operating one bank ...

Page 13

Table 10: DDR2 I Specifications and Conditions – 256MB (Continued) DD Values shown for MT47H32M8 DDR2 SDRAM only and are computed from values specified in the 256Mb (32 Meg x 8) component data sheet Parameter Operating bank interleave read current: ...

Page 14

Table 11: DDR2 I Specifications and Conditions – 512MB DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating one bank active-precharge current: t ...

Page 15

Table 11: DDR2 I Specifications and Conditions – 512MB (Continued) DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating bank interleave read current: ...

Page 16

Table 12: DDR2 I Specifications and Conditions – 1GB DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating one bank active-precharge current: ...

Page 17

Serial Presence-Detect For the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD. Table 13: SPD EEPROM Operating Conditions Parameter/Condition Supply voltage Input high voltage: logic 1; All inputs Input low voltage: logic 0; All inputs Output low voltage: I ...

Page 18

... FRONT VIEW 133.5 (5.256) 133.2 (5.244 0.76 (0.03) R 0.8 (0.031) TYP 123.0 (4.840) TYP BACK VIEW No Components This Side of Module 5.0 (0.197) TYP 63.0 (2.48) TYP additional design dimensions. times occur. 18 Module Dimensions U7 U8 30.5 (1.2) 29.85 (1.175) 17.78 (0.7) TYP 10 ...

Related keywords