MT18HTF25672FDY-80EE2D6 Micron Technology Inc, MT18HTF25672FDY-80EE2D6 Datasheet - Page 2

• Manufacturer Part Number: MT18HTF25672FDY-80EE2D6
• Manufacturer: Micron Technology Inc

Specifications of MT18HTF25672FDY-80EE2D6

• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240FBDIMM
• Device Core Size: 72b
• Organization: 256Mx72
• Total Density: 2GByte
• Chip Density: 1Gb
• Package Type: FBDIMM
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Number Of Elements: 18
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Lead Free Status / RoHS Status: Compliant

Table 1: Key Timing Parameters
Table 2: Addressing
Table 3: Part Numbers and Timing Parameters – 1GB
Base device: MT47H64M8,
Table 4: Part Numbers and Timing Parameters – 2GB
Base device: MT47H128M8,
PDF: 09005aef81a2f237
htf18c128_256x72fdy.pdf - Rev. D 12/09 EN
Parameter
Refresh count
Device bank address
Device page size per bank
Device configuration
Row address
Column address
Module rank address
Part Number
MT18HTF12872FDY-80E__
MT18HTF12872FDY-667__
MT18HTF12872FDY-53E__
Part Number
MT18HTF25672FDY-80E__
MT18HTF25672FDY-667__
MT18HTF25672FDY-53E__
Speed
Grade
Notes:
-80E
-667
-53E
1. Data sheets for the base devices can be found on Micron’s Web page.
2. All part numbers end with a four-place code (not shown) that designates component, PCB, and AMB revi-
Industry Nomenclature
sions. Consult factory for current revision codes. Example: MT18HTF25672FDY-667E1D4.
2
2
PC2-6400
PC2-5300
PC2-4200
1
1
512Mb DDR2 SDRAM
1Gb DDR2 SDRAM
Module
Density
Module
Density
2GB
2GB
2GB
1GB
1GB
1GB
Configuration
Configuration
256 Meg x 72
256 Meg x 72
256 Meg x 72
128 Meg x 72
128 Meg x 72
128 Meg x 72
CL = 5
800
667
–
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
512Mb (64 Meg x 8)
Data Rate (MT/s)
16K A[13:0]
2K A[9:0]
4 BA[1:0]
2 S#[1:0]
CL = 4
1GB
Bandwidth
1KB
Bandwidth
8K
533
533
533
2
Module
Module
6.4 GB/s
5.3 GB/s
4.3 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
Micron Technology, Inc. reserves the right to change products or specifications without notice.
CL = 3
Memory Clock/
Memory Clock/
3.75ns/533 MT/s
3.75ns/533 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
400
400
–
Data Rate
Data Rate
t
RCD (ns)
12.5
15
15
(CL-
(CL-
Clock Cycles
Clock Cycles
1Gb (128 Meg x 8)
© 2005 Micron Technology, Inc. All rights reserved.
t
t
5-5-5
5-5-5
4-4-4
5-5-5
5-5-5
4-4-4
RCD-
RCD-
16K A[13:0]
8 BA[2:0]
2K A[9:0]
2 S#[1:0]
t
2GB
1KB
RP (ns)
8K
t
t
12.5
RP)
RP)
15
15
Link Transfer
Link Transfer
Features
4.8 GT/s
4.0 GT/s
3.2 GT/s
4.8 GT/s
4.0 GT/s
3.2 GT/s
Rate
Rate
t
RC (ns)
55
55
55