BAP50-05W T/R NXP Semiconductors, BAP50-05W T/R Datasheet - Page 2

PIN Diodes PIN GP 50V 50MA

BAP50-05W T/R

Manufacturer Part Number
BAP50-05W T/R
Description
PIN Diodes PIN GP 50V 50MA
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP50-05W T/R

Configuration
Dual Common Cathode
Reverse Voltage
50V
Maximum Series Resistance @ Maximum If
5@10mAOhm
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Power Dissipation
240mW
Forward Current
50mA
Forward Voltage
1.1V
Operating Temperature Classification
Military
Package Type
SC-70
Mounting
Surface Mount
Typical Carrier Life Time
1.05us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Forward Continuous Current
50 mA
Carrier Life
1.05 us
Forward Voltage Drop
1.1 V
Maximum Diode Capacitance
0.5 pF at 5 V
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Package / Case
SOT-323
Lead Free Status / RoHS Status
Compliant
Other names
BAP50-05W,115
NXP Semiconductors
FEATURES
 Two elements in common cathode configuration in a
 Low diode capacitance
 Low diode forward resistance.
APPLICATIONS
 General RF applications.
DESCRIPTION
Two planar PIN diodes in common cathode configuration
in a SOT323 small SMD plastic package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2001 Apr 17
Per diode
V
I
P
T
T
SYMBOL
F
small-sized plastic SMD package
stg
j
R
tot
General purpose PIN diode
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
T
s
= 90 C
2
PINNING
handbook, halfpage
CONDITIONS
Marking code: W4-.
Fig.1 Simplified outline (SOT323) and symbol.
1
Top view
PIN
1
2
3
3
2
anode
anode
common cathode
65
65
MIN.
MAM382
1
Product specification
DESCRIPTION
BAP50-05W
50
50
240
+150
+150
MAX.
3
V
mA
mW
C
C
UNIT
2

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