BAP50-05W T/R NXP Semiconductors, BAP50-05W T/R Datasheet - Page 8

PIN Diodes PIN GP 50V 50MA

BAP50-05W T/R

Manufacturer Part Number
BAP50-05W T/R
Description
PIN Diodes PIN GP 50V 50MA
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP50-05W T/R

Configuration
Dual Common Cathode
Reverse Voltage
50V
Maximum Series Resistance @ Maximum If
5@10mAOhm
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Power Dissipation
240mW
Forward Current
50mA
Forward Voltage
1.1V
Operating Temperature Classification
Military
Package Type
SC-70
Mounting
Surface Mount
Typical Carrier Life Time
1.05us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Forward Continuous Current
50 mA
Carrier Life
1.05 us
Forward Voltage Drop
1.1 V
Maximum Diode Capacitance
0.5 pF at 5 V
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Package / Case
SOT-323
Lead Free Status / RoHS Status
Compliant
Other names
BAP50-05W,115
Printed in The Netherlands
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
R77/02/pp 8
Date of release: 2001 Apr 17

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