EMIF03-SIM02M8 STMicroelectronics, EMIF03-SIM02M8 Datasheet
EMIF03-SIM02M8
Specifications of EMIF03-SIM02M8
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EMIF03-SIM02M8 Summary of contents
Page 1
... CLK in 100 Ω Data in Maximum line capacitance = 20 pF Description The EMIF03-SIM02M8 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges the external pins ...
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... Series resistance between input and output I/O C Input capacitance per line line Symbol Test conditions Tolerance ± 20 Tolerance ± 20 MHz, V line R 2/ °C unless otherwise specified) amb Parameter °C) amb RM Min OSC EMIF03-SIM02M8 Value 125 - -55 to +150 Typ. Max. 6 7.9 0.2 100 Unit kV °C °C °C ...
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... EMIF03-SIM02M8 Figure 3. S21(db) attenuation (RST line) dB 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 F (Hz) -35.00 300.0k 1.0M 3.0M 10.0M 30.0M Figure 5. S21(db) attenuation (DATA line) dB 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 F (Hz) -35.00 300.0k 1.0M 3.0M 10.0M 30.0M Figure 7. ESD response to IEC 61000-4-2 ...
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... EMI Filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads 4/10 Figure 10. ESD response to IEC 61000-4-2 (-2 kV air discharge) applied to internal pin 20 ns/div Vcc Vcc RST RST in CLK CLK in Data Data in EMIF EMIF03-SIM02M8 20 ns/div EXT EXT EXT yy - xxx zz Mx ...
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... EMIF03-SIM02M8 4 Package information ● Epoxy meets UL94 order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... PCB. Only pin 1 mark used for this purpose. 6/10 4.00+/-0.1 4.00+/-0.1 2.0+/-0.05 2.0+/-0.05 0.75 0.75 1.70 1.70 User direction of unreeling User direction of unreeling EMIF03-SIM02M8 φ 1.5 +/- 0.1 φ 1.5 +/- 0.1 4.00 4.00 ...
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... EMIF03-SIM02M8 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 16. Stencil opening dimensions b) General Design Rule Stencil thickness ( 125 µm Aspect Ratio Aspect Area 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for central exposed pad: Opening to footprint ratio is 50% ...
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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 3°C/s max 3°C/s max 150 sec 90 to 150 sec EMIF03-SIM02M8 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec 90 sec max ...
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... EMIF03-SIM02M8 6 Ordering information Table 4. Ordering information Part number EMIF03-SIM02M8 7 Revision history Table 5. Document revision history Date 07-Oct-2007 Marking Package HA Micro QFN Revision 1 Initial release. Ordering information Weight Base qty Delivery mode 4 mg 3000 Tape and reel (7”) Changes 9/10 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF03-SIM02M8 ...