EMIF03-SIM05F3 STMicroelectronics, EMIF03-SIM05F3 Datasheet
EMIF03-SIM05F3
Specifications of EMIF03-SIM05F3
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EMIF03-SIM05F3 Summary of contents
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... Application ■ Mobile phones Description The EMIF03-SIM05F3 is a highly integrated device designed to protect SIM interface and SWP line against ESD transients and EMI emission. The device is the ideal fit for applications using NFC. ...
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... Parameter Breakdown voltage Leakage current @ V RM Stand-off voltage Clamping voltage Peak pulse current = 25 °C) amb Test conditions = 30 mV MHz osc = 30 mV MHz osc Doc ID 023284 Rev 1 EMIF03-SIM05F3 Value 150 - 150 Min ...
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... EMIF03-SIM05F3 Figure 4. Attenuation measurements C1-C3, A2-A3, B1-B3 S21(dB) 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 F(Hz) -30.00 100.0k 1.0M 10.0M Data Rst Figure 6. Analog Xtalk measurements XTalk (dB) 0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.00 -110.00 100.0k 1.0M 10.0M Clk -SWP Rst -Data Figure 8. Dynamic characteristic (SWP ( ( Figure 5. 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 100.0M 1.0G Clk Figure 7. ...
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... :clamping voltage @ :clamping voltage @ :clamping voltage @ 100 Div Doc ID 023284 Rev 1 EMIF03-SIM05F3 (-8 kV contact discharge) CLK line -249 -1 -342 Peak clamping voltage :clamping voltage @ :clamping voltage @ 60 ns ...
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... EMIF03-SIM05F3 Figure 14. ESD response to IEC 61000-4-2 (+8 kV contact discharge) SWP line Div 1 107 22 13.5 V Figure 16. ESD response to IEC 61000-4-2 (+8 kV contact discharge Div Figure 15. ESD response to IEC 61000-4 Div V : Peak clamping voltage :clamping voltage @ 30 ns ...
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... Ordering information scheme Figure 18. Ordering information scheme EMI filter Number of lines Information x = resistance value (ohms capacitance value / 10 (pF letters = application 2 digits = version Package F = Flip Chip lead-free, pitch = 400 µm, bump = 255 µm 6/9 EMIF Doc ID 023284 Rev 1 EMIF03-SIM05F3 yy - xxx zz Fx ...
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... EMIF03-SIM05F3 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 19. WLCSP package dimensions Figure 20. Footprint recommendations Copper pad Diameter: 220 µ ...
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... Order code EMIF03-SIM05F3 5 Revision history Table 4. Document revision history Date 12-Nov-2012 8/9 ± 0.05 2.0 1.30 ± 0.05 ± 0.05 User direction of unreeling Marking Package Weight LB WLCSP 1.9 mg Revision 1 Initial release. Doc ID 023284 Rev 1 EMIF03-SIM05F3 ± 0.10 Ø 1.50 ± 0.1 4.0 4.0 ± 0.1 Base qty Delivery mode 5000 Tape and reel (7”) Changes ...
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... EMIF03-SIM05F3 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...