EMIF03-SIM02C2_10 STMICROELECTRONICS [STMicroelectronics], EMIF03-SIM02C2_10 Datasheet
EMIF03-SIM02C2_10
Related parts for EMIF03-SIM02C2_10
EMIF03-SIM02C2_10 Summary of contents
Page 1
... SIM Interface (subscriber identify module) ■ UIM Interface (universal identify module) Description The EMIF03-SIM02C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF03 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which protects the application from damage when subjected to ESD surges ...
Page 2
... Parameter Parameter Breakdown voltage Clamping voltage Leakage current @ V RM Stand-off voltage Forward current Peak pulse current Breakdown current Forward voltage drop Doc ID 13251 Rev 3 EMIF03-SIM02C2 RST ext CLK ext Data ext Cline = 20pF max. Value 125 -40 to +85 -55 to +150 ...
Page 3
... Figure 7. -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.00 100.0M 1.0G Doc ID 13251 Rev 3 Characteristics Min Typ Max 6 20 0.2 1.5 100 47 20 S21 (dB) attenuation measurement (B1-B3 line) EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 dB 100.0k 1.0M 10.0M 100.0M f/Hz B1/B3 line Analog crosstalk measurements EMIF03-SIM02C2_FREQ-MEAS_PM428 Aplac 7.70 User: ST Microelectronics Sep 22 2004 0.00 dB 100.0k 1.0M 10.0M 100.0M f/Hz Xtalk A2/B3 Unit V µA Ω pF 1.0G 1.0G 3/8 ...
Page 4
... Rsub bulk Dext2 Dint1 Dext1 Dext1 0.25 0.28 0.25 Bulk Lbump Rbump Ls 100m a2 Lgnd Cgnd Rgnd Doc ID 13251 Rev 3 EMIF03-SIM02C2 Voltages when IEC 61000-4-2 (-15 kV air discharge) applied to external pin Vexternal : 5V/d Vinternal : 5V Rbump Lbump a3 Rsub Cbump bulk Rbump Lbump b1 Rsub Cbump bulk Rbump ...
Page 5
... EMIF03-SIM02C2 Figure 12. Aplac parameters Ls 950pH Rs 150m Cext1 15pF Cint1 4.5pF Cext2 14pF Cint2 4pF Rbump 20m Lbump 50pH Cbump 0.15pF Rgnd 500m Lgnd 50pH Cgnd 0.15pF Rsub 100m 2 Ordering information scheme Figure 13. Ordering information scheme EMI filter Number of lines Information 3 letters = application ...
Page 6
... Figure 16. Footprint recommendation Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µ Solder mask opening recommendation: y 340 µm min for 315 µm copper pad diameter w w Doc ID 13251 Rev 3 EMIF03-SIM02C2 ® 695µm ± 65 ...
Page 7
... EMIF03-SIM02C2 Figure 17. Flip-Chip tape and reel specification 0.78 +/- 0.05 All dimensions Ordering information Table 3. Ordering information Ordering code EMIF03-SIM02C2 5 Revision history Table 4. Document revision history Date 07-Feb-2007 21-Mar-2007 02-Sep-2010 Dot identifying Pin A1 location User direction of unreeling Marking Package Weight GR Flip Chip 3.04 mg Revision 1 Initial release ...
Page 8
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 13251 Rev 3 EMIF03-SIM02C2 ...