LMC555CMX/HAPB National Semiconductor, LMC555CMX/HAPB Datasheet - Page 10

• Manufacturer Part Number: LMC555CMX/HAPB
• Manufacturer: National Semiconductor
• Type: Standardr

Specifications of LMC555CMX/HAPB

• # Internal Timers: 1
• Power Dissipation: 740mW
• Propagation Delay Time: 100ns
• Operating Supply Voltage (typ): 1.5V
• Package Type: SOIC N
• High Level Output Current: -10mA
• Low Level Output Current: 50mA
• Pin Count: 8
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD Package
NS Package Number BPA08EFB
X
= 1.387 X
= 1.412 X
= 0.850
1
2
3
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