EMIF08-1005M16 STMicroelectronics, EMIF08-1005M16 Datasheet
EMIF08-1005M16
Specifications of EMIF08-1005M16
EMIF08-1005M16
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EMIF08-1005M16 Summary of contents
Page 1
... Figure 1. Basic cell configuration 100 Ω Input 1 Typical line capacitance = 45 pF typ Description The EMIF08-1005M16 is an 8-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes an ESD protection circuitry, which prevents damage to the application when subjected to ESD surges the input or output pins ...
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... Storage temperature range stg 2/10 Pin 1 Input 1 Pin 2 Input 21 Pin 3 Input 3 Input 4 Pin 4 Input 5 Pin 5 Pin 6 Input 6 Pin 7 Input 7 Pin 8 Input 8 Parameter EMIF08-1005M16 Pin 16 Output 1 Pin 15 Output 2 Output 3 Pin 14 Output 4 Pin 13 Output 5 Pin 12 Output 6 Pin 11 Pin 10 Output 7 Pin 9 Output 8 Value Unit 15 ...
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... EMIF08-1005M16 Table 2. Electrical characteristics (T Symbol Parameter V Breakdown voltage BR I Leakage current @ Stand-off voltage RM V Clamping voltage CL R Dynamic resistance d I Peak pulse current PP R Series resistance between Input and Output I/O C Input capacitance per line line Symbol per line Tolerance ± 10% ...
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... Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10 (pF) Package Mx = Micro QFN x leads 4/10 Figure 6. ) out C (pF) LINE V (V) LINE EMIF08-1005M16 ESD response to IEC 61000-4 air discharge) on one input (V ) and on one output (V in out 4 5 EMIF yy - xxx ...
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... EMIF08-1005M16 3 Package information ● Epoxy meets UL94 order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... PCB. Only pin 1 mark used for this purpose. 6/10 Dot identifying Pin A1 location 4.00 ± 0.1 2.00 ± 0 1.70 ± 0.1 0.80 ± 0.1 User direction of unreeling EMIF08-1005M16 Ø 1.55 ± 0. 4.00 ± 0.1 ...
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... EMIF08-1005M16 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 12. Stencil opening dimensions b) General design rule Stencil thickness ( 125 µm Aspect Ratio Aspect Area 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for central exposed pad: Opening to footprint ratio is 50% ...
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... To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 8/10 EMIF08-1005M16 ...
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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 5 Ordering information Table 4. Ordering information Part number EMIF08-1005M16 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 24-Oct-2006 04-Feb-2008 3°C/s max 3°C/s max ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF08-1005M16 ...