ICS843101AGI-100LFT IDT, Integrated Device Technology Inc, ICS843101AGI-100LFT Datasheet - Page 14

• Manufacturer Part Number: ICS843101AGI-100LFT
• Description: IC SYNTHESIZER 100MHZ 16-TSSOP
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: HiPerClockS™, FemtoClock®r
• Type: Frequency Synthesizerr

Specifications of ICS843101AGI-100LFT

• Pll: Yes
• Input: LVCMOS, LVTTL, Crystal
• Output: LVPECL
• Number Of Circuits: 1
• Ratio - Input:output: 2:1
• Differential - Input:output: No/Yes
• Frequency - Max: 100MHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Frequency-max: 100MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 843101AGI-100LFT

This section provides information on power dissipation and junction temperature for the ICS843101I-100.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843101I-100 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
flow and a multi-layer board, the appropriate value is 89°C/W per Table 9 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
IDT
ABLE
ICS843101I-100
FEMTOCLOCKS™ CRYSTAL-TO-LVPECL 100MHZ FREQUENCY MARGINING SYNTHESIZER
™
/ ICS
9. T
Power (core)
Power (outputs)
Total Power
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.429W *89°C/W = 123.2°C. This is below the limit of 125°C.
™
Multi-Layer PCB, JEDEC Standard Test Boards
JA
A
LVPECL FREQUENCY MARGINING SYNTHESIZER
= Ambient Temperature
HERMAL
= Junction-to-Ambient Thermal Resistance
R
MAX
ESISTANCE
_MAX
= V
MAX
(3.63V, with all outputs switching) = 398.48mW + 30mW = 428.48mW
= 30mW/Loaded Output pair
CC_MAX
* I
JA
EE_MAX
FOR
= 3.465V * 115mA = 398.48mW
16-
CC
PIN
= 3.3V + 5% = 3.465V, which gives worst case results.
P
JA
TSSOP, F
by Velocity (Meters per Second)
JA
OWER
* Pd_total + T
ORCED
C
ONSIDERATIONS
A
C
14
ONVECTION
89.0°C/W
0
TM
devices is 125°C.
81.8°C/W
1
ICS843101AGI-100 REV. A APRIL 26, 2007
JA
must be used. Assuming no air
78.1°C/W
2.5