ICS8624BYLF IDT, Integrated Device Technology Inc, ICS8624BYLF Datasheet - Page 13

• Manufacturer Part Number: ICS8624BYLF
• Description: IC BUFFER ZD 1-5 HSTL 32-LQFP
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: HiPerClockS™r
• Type: Fanout Distribution, Multiplexer , Zero Delay Bufferr

Specifications of ICS8624BYLF

• Pll: Yes with Bypass
• Input: HCSL, LVDS, LVHSTL, LVPECL, SSTL
• Output: HSTL
• Number Of Circuits: 1
• Ratio - Input:output: 2:5
• Differential - Input:output: Yes/Yes
• Frequency - Max: 700MHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 700MHz
• Number Of Elements: 1
• Supply Current: 120mA
• Pll Input Freq (min): 31.25MHz
• Pll Input Freq (max): 700MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: 0C to 70C
• Package Type: LQFP
• Output Frequency Range: Up to 700MHz
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.465V
• Operating Temperature Classification: Commercial
• Pin Count: 32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 8624BYLF

ICS8624 Data Sheet
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8624.
Equations and example calculations are also provided.
1.
The total power dissipation for the ICS8624 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Total Power_
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The
maximum recommended junction temperature for HiPerClockS devices is 125°C. Limiting the internal transistor junction temperature, Tj, to
125°C ensures that the bond wire and bond pad temperature remains below 125°C.
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ
a multi-layer board, the appropriate value is 47.9°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 7. Thermal Resistance
ICS8624BY REVISION E OCTOBER 6, 2009
Linear Feet per Minute
Multi-Layer PCB, JEDEC Standard Test Boards
Power Dissipation.
•
•
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 5 * 32.8mW = 164mW
The equation for Tj is as follows: Tj = θ
Tj = Junction Temperature
θ
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
70°C + 0.632W * 47.9°C/W = 100.3°C. This is well below the limit of 125°C.
JA
A
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
MAX
(3.465V, with all outputs switching) = 467.775mW + 164mW = 631.775mW
MAX
MAX
= V
= 32.8mW/Loaded Output pair
DD_MAX
θ
JA
* (I
for 32 Lead LQFP, Forced Convection
DD_MAX
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
JA
+ I
* Pd_total + T
DDA_MAX
)= 3.465V * (120mA + 15mA) = 467.775mW
θ
JA
A
47.9°C/W
vs. Air Flow
0
13
LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-HSTL ZERO DELAY BUFFER
42.1°C/W
200
JA
must be used. Assuming no air flow and
©2009 Integrated Device Technology, Inc.
39.4°C/W
500