M48T02-150PC1 STMicroelectronics, M48T02-150PC1 Datasheet - Page 17

• Manufacturer Part Number: M48T02-150PC1
• Description: IC TIMEKPR NVRAM 16KBIT 5V 24-DI
• Manufacturer: STMicroelectronics
• Series: Timekeeper®r
• Type: Clock/Calendar/NVSRAMr

Specifications of M48T02-150PC1

• Memory Size: 16K (2K x 8)
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: Parallel
• Voltage - Supply: 4.75 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 24-DIP (600 mil) Module
• Function: Clock/Calendar/NV Timekeeping RAM/Battery Backup
• Rtc Memory Size: 2048 Byte
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.75 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: Through Hole
• Rtc Bus Interface: Parallel
• Capacitance, Input: 10 pF
• Capacitance, Output: 10 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 80 mA
• Current, Output, Leakage: ±1
• Data Retention: 10 yrs.
• Density: 16K
• Memory Type: Non-Volatile SRAM
• Organization: 2K×8
• Package Type: PCDIP24
• Power Dissipation: 1 W
• Temperature, Operating: 0 to +70 °C
• Time, Access: 150 ns
• Time, Fall: ≤5 ns
• Time, Rise: ≤5 ns
• Voltage, Input, High: 5.05 to 5.8 V
• Voltage, Input, Low: 0.8 V
• Voltage, Output, High: 2.4 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 4.75 to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-2825-5

M48T02, M48T12
4
Caution:
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 6.
1. Soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds. In order to protect the lithium
2. For DIP packaged devices, ultrasonic vibrations should not be used for post-solder cleaning to avoid
Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
T
Symbol
battery, preheat temperatures must be limited such that the battery temperature does not exceed +85 °C.
Furthermore, the devices shall not be exposed to IR reflow.
damaging the crystal.
SLD
T
V
V
P
T
STG
I
CC
O
IO
A
D
(1)(2)
Absolute maximum ratings
Ambient operating temperature
Storage temperature (V
Lead solder temperature for 10 seconds
Input or output voltages
Supply voltage
Output current
Power dissipation
Doc ID 2410 Rev 8
Parameter
CC
off, oscillator off)
–40 to 85
–0.3 to 7
–0.3 to 7
0 to 70
Value
260
20
1
Maximum ratings
Unit
mA
°C
°C
°C
W
V
V
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