LTC2754BIUKG-16#PBF Linear Technology, LTC2754BIUKG-16#PBF Datasheet - Page 27

IC DAC 16BIT QUAD IOUT 52-QFN

LTC2754BIUKG-16#PBF

Manufacturer Part Number
LTC2754BIUKG-16#PBF
Description
IC DAC 16BIT QUAD IOUT 52-QFN
Manufacturer
Linear Technology
Datasheet

Specifications of LTC2754BIUKG-16#PBF

Settling Time
2µs
Number Of Bits
16
Data Interface
Serial, SPI™
Number Of Converters
4
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
52-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
PACKAGE DESCRIPTION
8.00 0.10
(2 SIDES)
0.75 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 6)
6.45 0.05
7.00 0.10
SIDE VIEW
TOP VIEW
(2 SIDES)
7.50 0.05
6.10 0.05
(2 SIDES)
5.50 REF
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.41 0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
0.50 BSC
0.25 0.05
(Reference LTC DWG # 05-08-1729 Rev Ø)
52-Lead Plastic QFN (7mm × 8mm)
0.200 REF
(2 SIDES)
6.50 REF
0.00 – 0.05
PACKAGE OUTLINE
UKG Package
0.75 0.05
0.70 0.05
7.10 0.05 8.50 0.05
(2 SIDES)
6.50 REF
0.00 – 0.05
R = 0.10
TYP
6.45 0.10
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
(2 SIDES)
5.50 REF
R = 0.30 TYP OR
5.41 0.10
PIN 1 NOTCH
0.35 45 C
CHAMFER
0.50 BSC
0.25 0.05
51
(UKG52) QFN REV Ø 0306
LTC2754
52
0.40 0.10
1
2
27
2754f

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