SRF 55V02P Y1.0 Infineon Technologies, SRF 55V02P Y1.0 Datasheet

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SRF 55V02P Y1.0

Manufacturer Part Number
SRF 55V02P Y1.0
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of SRF 55V02P Y1.0

Operating Temperature (max)
70C
Pin Count
2
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
Security & Chip Card ICs
my-d products for contactless systems
my-d vicinity
SRF 55V02P
Intelligent 2–KBit EEPROM
with Contactless Interface complying to ISO/IEC 15693
and Security Logic
Plain Mode Operation
Short Product Information
July 2002

Related parts for SRF 55V02P Y1.0

SRF 55V02P Y1.0 Summary of contents

Page 1

Security & Chip Card ICs my-d products for contactless systems my-d vicinity SRF 55V02P Intelligent 2–KBit EEPROM with Contactless Interface complying to ISO/IEC 15693 and Security Logic Plain Mode Operation Short Product Information July 2002 ...

Page 2

... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...

Page 3

Intelligent 2–KBit EEPROM with Contactless Interface complying to ISO/IEC 15693 and Security Logic my-d vicinity – Plain Mode Operation Features • 2-KBit EEPROM Organised in 32 pages located in 1 sector — Each page organised in 8 bytes for data ...

Page 4

... Ordering and Packaging information Table 1 Ordering Information Type Package SRF 55V02P C Die SRF 55V02P MCC8 P-MCC8-2-1 SRF 55V02P Y1.0 Inlay SRF 55V02P Y2.0 Inlay Available as a die (C) for customer packaging, as inlay ( Module Contactless Card (MCC) for embedding in plastic cards Short Product Information ...

Page 5

Pin Description Figure 1 Pin Configuration Label Inlay (top view) Figure 2 Pin Configuration Module Contactless Card (top view Figure 3 Pad Configuration Die Table 2 Pin Definitions and Functions Symbol Function L Antenna connection A L Antenna ...

Page 6

This family of contactless memories supports the different interface and memory size needs as well as ...

Page 7

This family of contactless memory chips supplies the user with different memory sizes and optionally offers the use of security features meeting the ...

Page 8

Circuit Description my-d vicinity consists of a EEPROM memory unit, an analog interface for contactless energy and data transmission and a control unit. Analog Contactless LA Interface Power Circuit Rectifier Clock Extractor Power on Reset Voltage Regulator LB Figure ...

Page 9

System Overview The system consists of a contactless label on one hand and a contactless reader together with an antenna on the other. Host System Analog µC Circuitry Identification Terminal Figure 6 Contactless System Example • VICC – Vicinity ...

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