MT16HTF25664AY-800G1 Micron Technology Inc, MT16HTF25664AY-800G1 Datasheet

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MT16HTF25664AY-800G1

Manufacturer Part Number
MT16HTF25664AY-800G1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT16HTF25664AY-800G1

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240UDIMM
Device Core Size
64b
Organization
256Mx64
Total Density
2GByte
Chip Density
1Gb
Access Time (max)
40ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Number Of Elements
16
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / Rohs Status
Compliant
DDR2 SDRAM UDIMM
MT16HTF6464AY – 512MB
MT16HTF12864AY – 1GB
MT16HTF25664AY – 2GB
MT16HTF51264AY – 4GB
Features
• 240-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC2-8500, PC2-6400,
• 512MB (64 Meg x 64), 1GB (128 Meg x 64),
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Multiple internal device banks for concurrent
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Serial presence detect (SPD) with EEPROM
• Gold edge contacts
• Dual rank
Table 1: Key Timing Parameters
PDF: 09005aef80f09084
htf16c64_128_256x64ay.pdf - Rev. G 3/10 EN
PC2-5300, PC2-4200, or PC2-3200
2GB (256 Meg x 64), 4GB (512 Meg x 64)
operation
Speed
Grade
-1GA
-80E
-800
-667
-53E
-40E
DD
DDSPD
= V
DDQ
= 1.7–3.6V
Nomenclature
1.8V
Products and specifications discussed herein are subject to change by Micron without notice.
Industry
PC2-8500
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
CL = 7
1066
t
CK
512MB, 1GB, 2GB, 4GB (x64, DR) 240-Pin DDR2 UDIMM
CL = 6
800
800
800
Data Rate (MT/s)
CL = 5
667
800
667
667
1
Figure 1: 240-Pin UDIMM (MO-237 R/C B and E)
Module height: 30.0mm (1.18in)
Options
• Operating temperature
• Package
• Frequency/CL
Notes:
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM (lead-free)
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533
– 5.0ns @ CL = 3 (DDR2-400)
CL = 4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
533
533
533
553
553
400
1. Contact Micron for industrial temperature
2. CL = CAS (READ) latency.
3. Available only in 2GB, Rev. E devices.
4. Not available in 512MB, 4GB module density.
5. Not recommended for new designs.
module offerings.
CL = 3
400
400
400
400
400
400
2
A
13.125
A
t
(ns)
12.5
RCD
≤ +85°C)
≤ +70°C)
15
15
15
15
© 2003 Micron Technology, Inc. All rights reserved.
4
4
5
5
3
1
13.125
(ns)
12.5
t
15
15
15
15
RP
Features
Marking
None
-1GA
-80E
-53E
-40E
-800
-667
58.125
(ns)
57.5
t
Y
I
60
60
55
55
RC

Related parts for MT16HTF25664AY-800G1

MT16HTF25664AY-800G1 Summary of contents

Page 1

... DDR2 SDRAM UDIMM MT16HTF6464AY – 512MB MT16HTF12864AY – 1GB MT16HTF25664AY – 2GB MT16HTF51264AY – 4GB Features • 240-pin, unbuffered dual in-line memory module • Fast data transfer rates: PC2-8500, PC2-6400, PC2-5300, PC2-4200, or PC2-3200 • 512MB (64 Meg x 64), 1GB (128 Meg x 64), 2GB (256 Meg x 64), 4GB (512 Meg x 64) • ...

Page 2

... Table 2: Addressing Parameter Refresh count Row address Device bank address Device configuration Column address Module rank address Table 3: Part Numbers and Timing Parameters – 512MB Modules (End of Life) 1 Base device: MT47H32M8, 256Mb DDR2 SDRAM Module 2 Part Number Density MT16HTF6464A(I)Y-667__ MT16HTF6464A(I)Y-53E__ MT16HTF6464A(I)Y-40E__ Table 4: Part Numbers and Timing Parameters – ...

Page 3

... The data sheet for the base device can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT16HTF25664AY-667E1. PDF: 09005aef80f09084 htf16c64_128_256x64ay.pdf - Rev. G 3/10 EN ...

Page 4

Pin Assignments Table 7: Pin Assignments 240-Pin UDIMM Front Pin Symbol Pin Symbol Pin DQ19 61 REF DQ0 33 DQ24 63 4 DQ1 34 DQ25 ...

Page 5

... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 8: Pin Descriptions Symbol Type Ax Input BAx Input ...

Page 6

... SPD EEPROM power supply: 1.7–3.6V. Reference voltage: V /2. DD Ground. No connect: These pins are not connected on the module. No function: These pins are connected within the module, but provide no functionality. Not used: These pins are not used in specific module configurations/operations. Reserved for future use. 6 Pin Descriptions and V ...

Page 7

Functional Block Diagram Figure 2: Functional Block Diagram (-1GA, -80E, -800, -667, -53E, -40E) – Raw Card E S1# S0 DQS0 DQS0 DM0 DM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ ...

Page 8

Figure 3: Functional Block Diagram (-53E, -40E) – Raw Card B S1# S0 DQS0 DQS0 DM0 DM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ DQS1# DQS1 DM1 ...

Page 9

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 10

... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data sheet are not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...

Page 11

... Component specifications are available on Micron's Web site. Module speed grades cor- relate with component speed grades. Table 10: Module and Component Speed Grades DDR2 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1GA ...

Page 12

I Specifications DD Table 11: DDR2 I Specifications and Conditions – 512MB DD Values shown for MT47H32M8 DDR2 SDRAM only and are computed from values specified in the 256Mb (32 Meg x 8) component data sheet Parameter Operating one bank ...

Page 13

... DD DD HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching 1. Value calculated as one module rank in this operating condition; all other module ranks Notes: 2. Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80f09084 htf16c64_128_256x64ay ...

Page 14

Table 12: DDR2 I Specifications and Conditions – 1GB DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating one bank active-precharge current: t ...

Page 15

... DD HIGH HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching 1. Value calculated as one module rank in this operating condition; all other module ranks Notes: 2. Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80f09084 htf16c64_128_256x64ay ...

Page 16

Table 13: DDR2 I Specifications and Conditions (Die Revision A) – 2GB DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating one ...

Page 17

... DD DD HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching 1. Value calculated as one module rank in this operating condition; all other module ranks Notes: 2. Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80f09084 htf16c64_128_256x64ay ...

Page 18

Table 14: DDR2 I Specifications and Conditions (Die Revision E) – 2GB DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating one ...

Page 19

... CKE is HIGH HIGH between valid commands; Address DD bus inputs are stable during deselects; Data bus inputs are switching 1. Value calculated as one module rank in this operating condition; all other module ranks Notes: 2. Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80f09084 htf16c64_128_256x64ay ...

Page 20

Table 15: DDR2 I Specifications and Conditions – 4GB DD Values shown for MT47H256M8 DDR2 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) com- ponent data sheet Parameter Operating one bank active-precharge current: ...

Page 21

... DD HIGH between valid commands; Address bus inputs are stable during dese- lects; Data bus inputs are switching 1. Value calculated as one module rank in this operating condition; all other module ranks Notes: 2. Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80f09084 htf16c64_128_256x64ay ...

Page 22

Serial Presence-Detect For the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD. Table 16: SPD EEPROM Operating Conditions Parameter/Condition Supply voltage Input high voltage: logic 1; All inputs Input low voltage: logic 0; All inputs Output low voltage: I ...

Page 23

... TYP TYP 123.0 (4.84) TYP Back view U12 U13 U14 5.0 (0.197) TYP 63.0 (2.48) TYP additional design dimensions. 23 Module Dimensions 17.78 (0.7) TYP 10.0 (0.394) TYP Pin 120 U15 U16 U17 Pin 121 Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 24

... TYP 123.0 (4.84) TYP Back view U13 U14 U16 5.0 (0.197) TYP 63.0 (2.48) TYP additional design dimensions. times occur. 24 Module Dimensions 17.78 (0.7) TYP 10.0 (0.394) TYP Pin 120 U17 U18 U19 Pin 121 Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

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