MT9HTF12872AY-800G1 Micron Technology Inc, MT9HTF12872AY-800G1 Datasheet

MT9HTF12872AY-800G1

Manufacturer Part Number
MT9HTF12872AY-800G1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT9HTF12872AY-800G1

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240RDIMM
Device Core Size
72b
Organization
128Mx72
Total Density
1GByte
Chip Density
1Gb
Access Time (max)
40ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
1.71A
Number Of Elements
9
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / Rohs Status
Compliant
DDR2 SDRAM UDIMM
MT9HTF3272AY – 256MB
MT9HTF6472AY – 512MB
MT9HTF12872AY – 1GB
Features
• 240-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC2-3200, PC2-4200,
• 256MB (32 Meg x 72), 512MB (64 Meg x 72), or 1GB
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Single rank
• Multiple internal device banks for concurrent
• Programmable CAS latency (CL)
• Posted CAS# additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Serial presence detect (SPD) with EEPROM
• Gold edge contacts
Table 1: Key Timing Parameters
PDF: 09005aef80e8ad4d
htf9c32_64_128x72ay – Rev. F 3/10 EN
PC2-5300, or PC2-6400
(128 Meg x 72)
operation
Speed
Grade
DD
DDSPD
-80E
-800
-667
-53E
-40E
= V
DDQ
= 1.7–3.6V
1.8V
Products and specifications discussed herein are subject to change by Micron without notice.
Nomenclature
Industry
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
t
CK
CL = 6
256MB, 512MB, 1GB (x72, SR, ECC) 240-Pin DDR2 UDIMM
800
800
CL = 5
Data Rate (MT/s)
800
667
667
1
Figure 1: 240-Pin UDIMM (MO-237 R/C A/F)
Module height 30.0mm (1.18in)
CL = 4
Options
• Operating temperature
• Package
• Frequency/CL
533
533
553
553
400
Notes:
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM (lead-free)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6(DDR2-800)
– 3.0ns @ CL = 6 (DDR2-667)
– 3.75ns @ CL = 5 (DDR2-53E)
– 5.0ns @ CL = 5 (DDR2-40E)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. Contact Micron for industrial temperature
2. CL = CAS (READ) latency.
3. Contact Micron for product availability.
4. Not available in 256MB density.
CL = 3
400
400
400
400
400
module offerings.
2
t
(ns)
12.5
RCD
15
15
15
15
A
A
≤ +85°C)
≤ +70°C)
© 2003 Micron Technology, Inc. All rights reserved.
3, 4
3, 4
1
(ns)
12.5
t
15
15
15
15
RP
Features
Marking
None
-80E
-53E
-40E
-800
-667
(ns)
t
55
55
55
55
55
Y
RC
I

Related parts for MT9HTF12872AY-800G1

MT9HTF12872AY-800G1 Summary of contents

Page 1

... DDR2 SDRAM UDIMM MT9HTF3272AY – 256MB MT9HTF6472AY – 512MB MT9HTF12872AY – 1GB Features • 240-pin, unbuffered dual in-line memory module • Fast data transfer rates: PC2-3200, PC2-4200, PC2-5300, or PC2-6400 • 256MB (32 Meg x 72), 512MB (64 Meg x 72), or 1GB (128 Meg x 72) • ...

Page 2

... Table 2: Addressing Parameter Refresh count Row address Device bank address Device configuration Column address Module rank address Table 3: Part Numbers and Timing Parameters – 256MB 1 Base device: MT47H32M8, 256Mb DDR2 SDRAM Module 2 Part Number Density MT9HTF3272A(I)Y-667__ MT9HTF3272A(I)Y-53E__ MT9HTF3272A(I)Y-40E__ Table 4: Part Numbers and Timing Parameters – 512MB ...

Page 3

... All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT9HTF6472AY-667C2. PDF: 09005aef80e8ad4d htf9c32_64_128x72ay – Rev. F 3/10 EN 256MB, 512MB, 1GB (x72, SR, ECC) 240-Pin DDR2 UDIMM Module Configuration Bandwidth 1GB 128 Meg ...

Page 4

Pin Assignments Table 6: Pin Assignments 240-Pin UDIMM Front Pin Symbol Pin Symbol Pin DQ19 61 REF DQ0 33 DQ24 63 4 DQ1 34 DQ25 ...

Page 5

... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 7: Pin Descriptions Symbol Type Ax Input BAx Input ...

Page 6

... SPD EEPROM power supply: 1.7–3.6V. Reference voltage: V /2. DD Ground. No connect: These pins are not connected on the module. No function: These pins are connected within the module, but provide no functionality. Not used: These pins are not used in specific module configurations/operations. Reserved for future use. 6 Pin Descriptions and V ...

Page 7

Functional Block Diagram Figure 2: Functional Block Diagram S0# DQS0# DQS0 DM0 DQS1# DQS1 DM1 DQS2# DQS2 DM2 DQS3# DQS3 DM3 DQS8# DQS8 DM8 BA[2/1:0] A[13/12:0] PDF: 09005aef80e8ad4d htf9c32_64_128x72ay – Rev. F 3/10 EN 256MB, 512MB, 1GB (x72, SR, ECC) ...

Page 8

... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 8: Pin Descriptions Symbol Type Ax Input BAx Input ...

Page 9

... SPD EEPROM power supply: 1.7–3.6V. Reference voltage: V /2. DD Ground. No connect: These pins are not connected on the module. No function: These pins are connected within the module, but provide no functionality. Not used: These pins are not used in specific module configurations/operations. Reserved for future use. 9 Pin Descriptions and V ...

Page 10

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 11

... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data sheet are not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...

Page 12

... Component specifications are available on Micron's Web site. Module speed grades cor- relate with component speed grades. Table 10: Module and Component Speed Grades DDR2 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1GA ...

Page 13

I Specifications DD Table 11: DDR2 I Specifications and Conditions – 256MB DD Values shown for MT47H32M8 DDR2 SDRAM only and are computed from values specified in the 256Mb (32 Meg x 8) component data sheet Parameter Operating one bank ...

Page 14

Table 12: DDR2 I Specifications and Conditions – 512MB DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating one bank active-precharge current: t ...

Page 15

Table 12: DDR2 I Specifications and Conditions – 512MB (Continued) DD Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter Operating bank interleave read current: ...

Page 16

Table 13: DDR2 I Specifications and Conditions (Die Revision A) – 1GB DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating one ...

Page 17

Table 13: DDR2 I Specifications and Conditions (Die Revision A) – 1GB (Continued) DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating ...

Page 18

Table 14: DDR2 I Specifications and Conditions (Die Revision E) – 1GB DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating one ...

Page 19

Table 14: DDR2 I Specifications and Conditions (Die Revision E) – 1GB (Continued) DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating ...

Page 20

Serial Presence-Detect For the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD. Table 15: SPD EEPROM Operating Conditions Parameter/Condition Supply voltage Input high voltage: logic 1; All inputs Input low voltage: logic 0; All inputs Output low voltage: I ...

Page 21

... TYP Pin 1 2.21 (0.087) TYP 1.0 (0.039) TYP 1.0 (0.039) TYP 70.66 (2.782) No components this side of module 3.04 (0.1197) TYP Pin 240 55.0 (2.165) TYP 1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted. Notes: 2. The dimensional diagram is for reference only. Refer to the JEDEC MO document for 8000 S ...

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