MT16HTF25664AZ-667H1 Micron Technology Inc, MT16HTF25664AZ-667H1 Datasheet

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MT16HTF25664AZ-667H1

Manufacturer Part Number
MT16HTF25664AZ-667H1
Description
MODULE DDR2 SDRAM 2GB 240UDIMM
Manufacturer
Micron Technology Inc
Series
-r

Specifications of MT16HTF25664AZ-667H1

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240UDIMM
Device Core Size
64b
Organization
256Mx64
Chip Density
1Gb
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
1.136A
Number Of Elements
16
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Memory Type
DDR2 SDRAM
Memory Size
2GB
Speed
667MT/s
Features
-
Package / Case
240-UDIMM
Lead Free Status / Rohs Status
Supplier Unconfirmed
DDR2 SDRAM UDIMM
MT16HTF25664AZ – 2GB
MT16HTF51264AZ – 4GB
Features
• 240-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC2-8500, PC2-6400,
• 2GB (256 Meg x 64), 4GB (512 Meg x 64)
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Multiple internal device banks for concurrent
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Serial presence detect (SPD) with EEPROM
• Gold edge contacts
• Dual rank
• Halogen-free
Table 1: Key Timing Parameters
PDF: 09005aef80ed6fda
htf16c256_512x64az – Rev. C 3/10 EN
PC2-5300, PC2-4200, or PC2-3200
operation
Speed
Grade
-1GA
-80E
-800
-667
-53E
-40E
DD
DDSPD
= V
DDQ
= 1.7–3.6V
Nomenclature
1.8V
Products and specifications discussed herein are subject to change by Micron without notice.
Industry
PC2-8500
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
CL = 7
1066
t
CK
CL = 6
800
800
800
2GB, 4GB (x64, DR) 240-Pin DDR2 SDRAM UDIMM
Data Rate (MT/s)
CL = 5
667
800
667
667
1
Figure 1: 240-Pin UDIMM (MO-237 R/C E)
Module height: 30mm (1.18in)
Options
• Operating temperature
• Package
• Frequency/CL
Notes:
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM (halogen-free)
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3ns @ CL = 5 (DDR2-667)
CL = 4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
533
533
533
553
553
400
1. Contact Micron for industrial temperature
2. CL = CAS (READ) latency.
3. Not recommended for new designs.
module offerings.
CL = 3
400
400
400
400
400
400
2
A
13.125
A
t
(ns)
12.5
RCD
≤ +85°C)
≤ +70°C)
15
15
15
15
© 2009 Micron Technology, Inc. All rights reserved.
3
1
13.125
(ns)
12.5
t
15
15
15
15
RP
Features
Marking
None
-1GA
-80E
-800
-667
58.125
(ns)
57.5
t
Z
I
60
60
55
55
RC

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MT16HTF25664AZ-667H1 Summary of contents

Page 1

... DDR2 SDRAM UDIMM MT16HTF25664AZ – 2GB MT16HTF51264AZ – 4GB Features • 240-pin, unbuffered dual in-line memory module • Fast data transfer rates: PC2-8500, PC2-6400, PC2-5300, PC2-4200, or PC2-3200 • 2GB (256 Meg x 64), 4GB (512 Meg x 64) • 1.8V DD DDQ • 1.7–3.6V DDSPD • ...

Page 2

... Table 2: Addressing Parameter Refresh count Row address Device bank address Device configuration Column address Module rank address Table 3: Part Numbers and Timing Parameters – 2GB Modules 1 Base device: MT47H128M8, 1Gb DDR2 SDRAM Module 2 Part Number Density MT16HTF25664A(I)Z-1GA__ MT16HTF25664A(I)Z-80E__ MT16HTF25664A(I)Z-800__ MT16HTF25664A(I)Z-667__ Table 4: Part Numbers and Timing Parameters – 4GB Modules ...

Page 3

Pin Assignments Table 5: Pin Assignments 240-Pin UDIMM Front Pin Symbol Pin Symbol Pin DQ19 61 REF DQ0 33 DQ24 63 4 DQ1 34 DQ25 ...

Page 4

... Pin Descriptions The pin description table below is a comprehensive list of all possible pins for all DDR2 modules. All pins listed may not be supported on this module. See Pin Assignments for information specific to this module. Table 6: Pin Descriptions Symbol Type Ax Input BAx Input ...

Page 5

... SPD EEPROM power supply: 1.7–3.6V. Reference voltage: V /2. DD Ground. No connect: These pins are not connected on the module. No function: These pins are connected within the module, but provide no functionality. Not used: These pins are not used in specific module configurations/operations. Reserved for future use. 5 Pin Descriptions and V ...

Page 6

Functional Block Diagram Figure 2: Functional Block Diagram S1# S0 DQS0 DQS0 DM0 DM DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ DQS1# DQS1 DM1 DM DQ8 DQ ...

Page 7

... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...

Page 8

... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data sheet are not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...

Page 9

... Component specifications are available on Micron's Web site. Module speed grades cor- relate with component speed grades. Table 8: Module and Component Speed Grades DDR2 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1GA ...

Page 10

I Specifications DD Table 9: DDR2 I Specifications and Conditions – 2GB DD Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com- ponent data sheet Parameter Operating one ...

Page 11

... DD DD HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching 1. Value calculated as one module rank in this operating condition; all other module ranks Notes: 2. Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80ed6fda htf16c256_512x64az – ...

Page 12

Table 10: DDR2 I Specifications and Conditions – 4GB DD Values shown for MT47H256M8 DDR2 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) com- ponent data sheet Parameter Operating one bank active-precharge current: ...

Page 13

... DD DD HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching 1. Value calculated as one module rank in this operating condition; all other module ranks Notes: 2. Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80ed6fda htf16c256_512x64az – ...

Page 14

Serial Presence-Detect For the latest SPD data, refer to Micron's SPD page: www.micron.com/SPD. Table 11: SPD EEPROM Operating Conditions Parameter/Condition Supply voltage Input high voltage: logic 1; All inputs Input low voltage: logic 0; All inputs Output low voltage: I ...

Page 15

... R 0.8 (0.031) TYP 123.0 (4.84) TYP Back view U13 U14 U15 5.0 (0.197) TYP 63.0 (2.48) additional design dimensions. times occur. 15 Module Dimensions 17.78 (0.7) TYP 10.0 (0.394) TYP Pin 120 U16 U17 U18 Pin 121 TYP Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

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