MT36JSZF1G72PZ-1G4D1 Micron Technology Inc, MT36JSZF1G72PZ-1G4D1 Datasheet
MT36JSZF1G72PZ-1G4D1
Specifications of MT36JSZF1G72PZ-1G4D1
Related parts for MT36JSZF1G72PZ-1G4D1
MT36JSZF1G72PZ-1G4D1 Summary of contents
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... DDR3 SDRAM RDIMM MT36JSZF51272PZ – 4GB MT36JSZF1G72PZ – 8GB Features • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module (RDIMM) • Fast data transfer rates: PC3-12800, PC3-10600, PC3-8500, or PC3-6400 • Heat spreader • ...
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... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT36JSZF1G72PZ-1G1D1. PDF: 09005aef83992c00 jszf36c512_1gx72pz.pdf - Rev. C 4/10 EN ...
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Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin DDR3 RDIMM Front Pin Symbol Pin Symbol Pin DQ25 61 REFDQ DQ0 33 DQS3 DQ1 34 DQS3 64 ...
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... Input with write data. Center-aligned with write data. SDA I/O Serial data: SDA is a bidirectional pin used to transfer addresses and data into and out of the temperature sensor/SPD EEPROM on the module on the I Err_Out# Output Parity error output: Parity error found on the command and address bus. ...
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... REFDQ V Supply Ground Supply Termination voltage: Used for control, command, and address (V TT – connect: These pins are not connected on the module. – NU Not usable: No connections allowed. PDF: 09005aef83992c00 jszf36c512_1gx72pz.pdf - Rev. C 4/10 EN 4GB, 8GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM . DD /2 Micron Technology, Inc ...
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... DQ Map Table 7: Component-to-Module DQ Map, Front Component Reference Component Number DQ Module U11 U13 U15 U17 PDF: 09005aef83992c00 jszf36c512_1gx72pz.pdf - Rev. C 4/10 EN 4GB, 8GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM Component Module Pin Reference Number Number CB2 45 U8 CB0 39 CB3 46 CB1 U10 114 U12 ...
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... Table 7: Component-to-Module DQ Map, Front (Continued) Component Reference Component Number DQ Module DQ U19 Table 8: Component-to-Module DQ Map, Back Component Reference Component Number DQ Module DQ U21 U23 U25 U27 U29 U31 PDF: 09005aef83992c00 jszf36c512_1gx72pz.pdf - Rev. C 4/10 EN 4GB, 8GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM Component Module Pin ...
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... Table 8: Component-to-Module DQ Map, Back (Continued) Component Reference Component Number DQ Module DQ U33 U35 U37 PDF: 09005aef83992c00 jszf36c512_1gx72pz.pdf - Rev. C 4/10 EN 4GB, 8GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM Component Module Pin Reference Number Number 38 206 U34 37 201 39 207 36 200 30 155 U36 29 150 31 156 ...
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Functional Block Diagram Figure 2: Functional Block Diagram V SS RS0# RS1# DQS0 DQS0# DM CS# DQS DQS# DM CS# DQS DQS# DQ DQ0 U29 DQ1 DQ DQ DQ2 DQ DQ DQ3 DQS1 ...
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... DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data trans- fers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals ...
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... TSE2002av, Serial Presence Detect with Temperature Sensor.” Serial Presence-Detect EEPROM Operation DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with JE- DEC standard JC-45, “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM Modules.” ...
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... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...
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... Component specifications are available on Micron’s Web site. Module speed grades cor- relate with component speed grades, as shown below. Table 11: Module and Component Speed Grades DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades Module Speed Grade -1G6 ...
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... Self refresh temperature current (SRT-enabled): MAX T = 95°C C All banks interleaved read current Reset current 1. One module rank in the active I Notes: 2. All ranks in this I Table 13: DDR3 I Specifications and Conditions – 8GB DD Values are for the MT41J512M4 DDR3 SDRAM only and are computed from values specified in the 2Gb (512 Meg x 4) ...
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... Self refresh temperature current: MAX T Self refresh temperature current (SRT-enabled): MAX T = 95°C C All banks interleaved read current Reset current 1. One module rank in the active I Notes: 2. All ranks in this I PDF: 09005aef83992c00 jszf36c512_1gx72pz.pdf - Rev. C 4/10 EN 4GB, 8GB (x72, ECC, DR) 240-Pin DDR3 SDRAM RDIMM Symbol ...
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... RESET#, MIRROR 0.65 × V RESET#, MIRROR CK, CK#, FBIN, FBIN# 0.5 × V CK, CK# Err_Out# Err_Out# tion of the DDR3 SDRAM RDIMMs. These are meant subset of the parameters for the specific device used on the module. 16 Min Nom Max 1.425 1.5 1.575 - 20mV 0.5 × V 0.51 × ...
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... Temperature Sensor with Serial Presence-Detect EEPROM The temperature sensor continuously monitors the module’s temperature and can be read back at any time over the I Table 15: Temperature Sensor with Serial Presence-Detect EEPROM Operating Conditions Parameter/Condition Supply voltage Supply current 3.3V DD Input high voltage: Logic 1; SCL, SDA Input low voltage: Logic 0 ...
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The interrupt mode enables software to reset EVENT# after a critical temperature thresh- old has been detected. Threshold points are set in the configuration register by the user. This mode triggers the critical temperature limit and both the MIN and ...
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Figure 3: EVENT# Pin Functionality Critical Alarm window (MAX) Alarm window (MIN) EVENT# interrupt mode EVENT# comparator mode EVENT# critical temperature only mode Table 17: Temperature Sensor Registers Name Pointer register Capability register Configuration register Alarm temperature upper boundary register ...
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Table 18: Pointer Register Bits 0– Table 19: Pointer Register Bits 0–2 Descriptions Capability Register The capability register indicates the features and functionality supported by the temper- ature sensor. ...
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Table 21: Capability Register Bit Description (Continued) Bit Description 4:3 Temperature resolution 00: 0.5°C LSB 01: 0.25°C LSB 10: 0.125°C LSB 11: 0.0625°C LSB 15:5 0: Must be set to zero Configuration Register Table 22: Configuration Register (Address: 0x01) 15 ...
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Table 23: Configuration Register Bit Descriptions (Continued) Bit Description 6 Alarm window lock bit 0: Alarm trips are not locked and can be changed 1: Alarm trips are locked and cannot be changed 7 Critical trip lock bit 0: Critical ...
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Figure 4: Hysteresis Applied to Temperature Around Trip Points Below window bit Above window bit 1. T Notes Hyst is the value set in the hysteresis bits of the configuration register. Table 24: Hysteresis Applied to Alarm ...
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Temperature Trip Point Registers The upper and lower temperature boundary registers are used to set the maximum and minimum values of the alarm window. LSB for these registers is 0.25°C. All RFU bits in the register will always report zero. ...
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Table 28: Temperature Register (Address: 0x05 Above Above Below MSB critical alarm alarm trip window window Table 29: Temperature Register Bit Descriptions Bit Description 13 Below alarm window 0: Temperature is equal to or above the lower ...
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... U7 U14 U15 U16 U17 U18 U23 U24 U26 U27 U28 U32 U33 U34 U35 U36 26 Module Dimensions U10 U11 23.3 (0.92) TYP U19 U20 17.3 (0.68) TYP 9.5 (0.374) 0.8 (0.031) TYP TYP Pin 120 1.0 (0.039) R (8X) U28 U29 3.1 (0.122) 2X TYP ...
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... Revision History Rev. C, Production – 04/10 • Updated 8GB module IDDs for V69A (die rev D) values. 1600 IDDs changed from TBD to device data sheet (die rev D)-based values. Rev. B, Production – 08/09 • Added 8GB module density. Rev. A, Production – 05/09 • ...