MT48H16M32LFCM-8 IT:A Micron Technology Inc, MT48H16M32LFCM-8 IT:A Datasheet - Page 26

• Manufacturer Part Number: MT48H16M32LFCM-8 IT:A
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M32LFCM-8 IT:A

• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 9/7ns
• Maximum Clock Rate: 125MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 115mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Figure 13:
PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. J 2/08 EN
Random READ Accesses
Notes:
COMMAND
COMMAND
1. Each READ command may be to any bank. DQM is LOW.
Data from any READ burst may be truncated with a subsequent WRITE command, and
data from a fixed-length READ burst may be immediately followed by data from a
WRITE command (subject to bus turnaround limitations). The WRITE burst may be
initiated on the clock edge immediately following the last (or last desired) data element
from the READ burst, provided that I/O contention can be avoided. In a given system
design, there may be a possibility that the device driving the input data will go Low-Z
before the SDRAM DQs go High-Z. In this case, at least a single-cycle delay should occur
between the last read data and the WRITE command.
The DQM input is used to avoid I/O contention, as shown in Figure 14 on page 27 and
Figure 15 on page 28. The DQM signal must be asserted (HIGH) at least two clocks prior
to the WRITE command (DQM latency is two clocks for output buffers) to suppress data-
out from the READ. Once the WRITE command is registered, the DQs will go High-Z (or
remain High-Z), regardless of the state of the DQM signal, provided the DQM was active
on the clock just prior to the WRITE command that truncated the READ command. If
not, the second WRITE will be an invalid WRITE. For example, if DQM was LOW during
T4 (in Figure 15 on page 28) then the WRITEs at T5 and T7 would be valid, while the
WRITE at T6 would be invalid.
ADDRESS
ADDRESS
CLK
CLK
DQ
DQ
T0
BANK,
T0
COL n
BANK,
COL n
READ
READ
CL = 2
T1
T1
BANK,
BANK,
READ
COL a
READ
COL a
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
CL = 3
26
T2
BANK,
T2
COL x
BANK,
READ
READ
COL x
D
OUT
n
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T3
T3
BANK,
COL m
READ
READ
BANK,
COL m
D
D
OUT
OUT
a
n
T4
T4
NOP
NOP
D
D
OUT
OUT
x
a
T5
T5
NOP
NOP
D
D
OUT
m
OUT
x
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T6
NOP
D
OUT
m
Operations