MT46H8M32LFB5-6IT:H Micron Technology Inc, MT46H8M32LFB5-6IT:H Datasheet

MT46H8M32LFB5-6IT:H

Manufacturer Part Number

MT46H8M32LFB5-6IT:H

Description

MICMT46H8M32LFB5-6_IT:H MDDDR

Manufacturer

Micron Technology Inc

Datasheet

1.MT46H8M32LFB5-6ITH.pdf (96 pages)

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Mobile Low-Power DDR SDRAM

MT46H16M16LF – 4 Meg x 16 x 4 Banks

MT46H8M32LF – 2 Meg x 32 x 4 Banks

Features

• V

• Bidirectional data strobe per byte of data (DQS)

• Internal, pipelined double data rate (DDR) architec-

• Differential clock inputs (CK and CK#)

• Commands entered on each positive CK edge

• DQS edge-aligned with data for READs; center-

• 4 internal banks for concurrent operation

• Data masks (DM) for masking write data—one mask

• Programmable burst lengths (BL): 2, 4, 8, or 16

• Concurrent auto precharge option is supported

• Auto refresh and self refresh modes

• 1.8V LVCMOS-compatible inputs

• On-chip temp sensor to control self refresh rate

• Partial-array self refresh (PASR)

• Deep power-down (DPD)

• Status read register (SRR)

• Selectable output drive strength (DS)

• Clock stop capability

• 64ms refresh

PDF: 09005aef834bf85b

256mb_mobile_ddr_sdram_t36n.pdf - Rev. I 09/10 EN

ture; two data accesses per clock cycle

aligned with data for WRITEs

per byte

DDQ

= 1.70–1.95V

Products and specifications discussed herein are subject to change by Micron without notice.

Table 1: Configuration Addressing

Architecture 16 Meg x 16 8 Meg x 32

Configuration 4 Meg x 16 x

Refresh count

Row

addressing

Column

addressing

256Mb: x16, x32 Mobile LPDDR SDRAM

Notes:

Options

• V

• Configuration

• Row-size option

• Plastic "green" package

• Timing – cycle time

• Operating temperature range

• Design revision

– 1.8V/1.8V

– 16 Meg x 16 (4 Meg x 16 x 4

– 8 Meg x 32 (2 Meg x 32 x 4

– JEDEC-standard option

– Reduced page-size option

– 60-ball VFBGA (8mm x 9mm)

– 90-ball VFBGA (8mm x 13mm)

– 5ns @ CL = 3 (200 MHz)

– 5.4ns @ CL = 3 (185 MHz)

– 6ns @ CL = 3 (166 MHz)

– 7.5ns @ CL = 3 (133 MHz)

– Commercial (0˚ to +70˚C)

– Industrial (–40˚C to +85˚C)

Micron Technology, Inc. reserves the right to change products or specifications without notice.

banks)

1. Only available for x16 configuration.

2. Only available for x32 configuration.

DDQ

8K A[12:0]

512 A[8:0]

4 banks

2 Meg x 32 x

4K A[11:0]

512 A[8:0]

4 banks

Marking

Features

2 Meg x 32

Page-Size

8K A[12:0]

256 A[7:0]

16M16

Reduced

x 4 banks

8M32

Option

None

-54

-75

-5

-6

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