ADSP-2185MKST-300 Analog Devices Inc, ADSP-2185MKST-300 Datasheet - Page 20

• Manufacturer Part Number: ADSP-2185MKST-300
• Description: IC DSP CONTROLLER 16BIT 100LQFP
• Manufacturer: Analog Devices Inc
• Series: ADSP-21xxr
• Type: Fixed Pointr

Specifications of ADSP-2185MKST-300

• Rohs Status: RoHS non-compliant
• Interface: Host Interface, Serial Port
• Clock Rate: 75MHz
• Non-volatile Memory: External
• On-chip Ram: 80kB
• Voltage - I/o: 3.30V
• Voltage - Core: 2.50V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Device Core Size: 16b
• Architecture: Enhanced Harvard
• Format: Fixed Point
• Clock Freq (max): 75MHz
• Mips: 75
• Device Input Clock Speed: 75MHz
• Ram Size: 80KB
• Program Memory Size: Not RequiredKB
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (min): 2.37V
• Operating Supply Voltage (max): 2.63/3.6V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / Rohs Status: Not Compliant

FREQUENCY DEPENDENCY FOR TIMING
SPECIFICATIONS
t
with a frequency equal to half the instruction rate. For example,
a 37.50 MHz input clock (which is equivalent to 26.6 ns) yields
a 13.3 ns processor cycle (equivalent to 75 MHz). t
within the range of 0.5 t
relevant timing parameters to obtain the specification value.
Example: t
ENVIRONMENTAL CONDITIONS
Rating
Description
Thermal Resistance
Thermal Resistance
Thermal Resistance
NOTE
1
POWER DISSIPATION
To determine total power dissipation in a specific application,
the following equation should be applied for each output:
C = load capacitance, f = output switching frequency.
Example:
In an application where external data memory is used and no other
outputs are active, power dissipation is calculated as follows:
Assumptions:
• External data memory is accessed every cycle with 50% of the
• External data memory writes occur every other cycle with
ADSP-2185M
CK
Where the Ambient Temperature Rating (T
T
T
PD = Power Dissipation in W
AMB
CASE
(Case-to-Ambient)
(Junction-to-Ambient)
(Junction-to-Case)
address pins switching.
50% of the data pins switching.
is defined as 0.5 t
= T
= Case Temperature in °C
CASE
CKH
– (PD × θ
= 0.5 t
CKI
CA
)
CK
. The ADSP-2185M uses an input clock
CKI
– 2 ns = 0.5 (15 ns) – 2 ns = 5.5 ns
C × V
Symbol
θ
θ
θ
period should be substituted for all
CA
JA
JC
DD
2 × f
AMB
1
) is:
LQFP
48°C/W
50°C/W
2°C/W
CK
Mini-BGA
63.3°C/W
70.7°C/W
7.4°C/W
values
• Each address and data pin has a 10 pF total load at the pin.
• The application operates at V
Total Power Dissipation = P
P
(C × V
Parameters
Address
Data Output, WR
RD
CLKOUT, DMS
Total power dissipation for this example is P
Output Drive Currents
Figure 14 shows typical I-V characteristics for the output drivers
on the ADSP-2185M. The curves represent the current drive
capability of the output drivers as a function of output voltage.
INT
graph (Figure 15).
= internal power dissipation from Power vs. Frequency
DDEXT
–20
–40
–60
–80
80
60
40
20
0
0
2
× f ) is calculated for each output:
V
V
V
0.5
DDEXT
DDEXT
DDEXT
= 3.3V @ +25 C
= 2.5V @ +85 C
= 3.6V @ –40 C
# of
Pins
7
9
1
2
1.0
V
OL
SOURCE VOLTAGE – V
INT
1.5
V
+ (C × V
pF
10
10
10
10
DDEXT
DDEXT
C
2.0
V
DDEXT
V
= 3.6V @ –40 C
OH
V
V
3.3
3.3
3.3
3.3
= 3.3 V and t
2.5
DDEXT
DDEXT
= 2.5V @ +85 C
V
2
2
2
2
DDEXT
= 3.3V @ +25 C
INT
3.0
2
× f )
2
+ 38.0 mW.
3.5
MHz
16.67
16.67
16.67
33.3
CK
f
= 30 ns.
4.0
PD
mW
12.7
16.3
38.0
1.8
7.2