EP3C5F256C6 Altera, EP3C5F256C6 Datasheet - Page 13

• Manufacturer Part Number: EP3C5F256C6
• Description: IC CYCLONE III FPGA 5K 256-FBGA
• Manufacturer: Altera
• Series: Cyclone® IIIr

Specifications of EP3C5F256C6

• Number Of Logic Elements/cells: 5136
• Number Of Labs/clbs: 321
• Total Ram Bits: 423936
• Number Of I /o: 182
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-FBGA
• For Use With: 544-2601 - KIT DEV CYCLONE III LS EP3CLS200544-2411 - KIT DEV NIOS II CYCLONE III ED.
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Other names: 544-2418; EP3C5F256C6

Chapter 1: Cyclone III Device Family Overview
Chapter Revision History
Chapter Revision History
Table 1–7. Chapter Revision History
© December 2009 Altera Corporation
December 2009
July 2009
June 2009
October 2008
May 2008
July 2007
March 2007
Date
Table 1–7
Version
2.2
2.1
2.0
1.3
1.2
1.1
1.0
lists the revision history for this chapter.
Minor text edits.
Minor edit to the hyperlinks.
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Initial release.
Added Table 1–5.
Updated Table 1–1, Table 1–2, Table 1–3, and Table 1–4.
Updated “Introduction”, “Cyclone III Device Family Architecture”, “Embedded
Multipliers and Digital Signal Processing Support ”, “Clock Networks and
PLLs ”, “I/O Features ”, “High-Speed Differential Interfaces ”, “Auto-
Calibrating External Memory Interfaces ”, “Quartus II Software Support”,
“Configuration ”, and “Design Security (Cyclone III LS Devices Only)”.
Removed “Referenced Document” section.
Updated “Increased System Integration” section.
Updated “Memory Blocks” section.
Updated chapter to new template.
Added 164-pin Micro FineLine Ball-Grid Array (MBGA) details to Table 1–2,
Table 1–3 and Table 1–4.
Updated Figure 1–2 with automotive temperature information.
Updated “Increased System Integration” section, Table 1–6, and “High-Speed
Differential Interfaces” section with BLVDS information.
Removed the text “Spansion” in “Increased System.
Integration” and “Configuration” sections.
Removed trademark symbol from “MultiTrack” in “MultiTrack Interconnect”.
Removed registered trademark symbol from “Simulink” and “MATLAB” from
“Embedded Multipliers and Digital.
Signal Processing Support” section.
Added chapter TOC and “Referenced Documents” section.
Changes Made
Cyclone III Device Handbook, Volume 1
1–13