EP1S30B956C7 Altera, EP1S30B956C7 Datasheet - Page 9

• Manufacturer Part Number: EP1S30B956C7
• Description: IC STRATIX FPGA 30K LE 956-BGA
• Manufacturer: Altera
• Series: Stratix®r

Specifications of EP1S30B956C7

• Number Of Logic Elements/cells: 32470
• Number Of Labs/clbs: 3247
• Total Ram Bits: 3317184
• Number Of I /o: 683
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 956-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Other names: 544-1418; EP1S30SB956C7

Introduction
Altera Corporation
July 2005
S51001-3.2
The Stratix
SRAM process, with densities of up to 79,040 logic elements (LEs) and up
to 7.5 Mbits of RAM. Stratix devices offer up to 22 digital signal
processing (DSP) blocks with up to 176 (9-bit × 9-bit) embedded
multipliers, optimized for DSP applications that enable efficient
implementation of high-performance filters and multipliers. Stratix
devices support various I/O standards and also offer a complete clock
management solution with its hierarchical clock structure with up to
420-MHz performance and up to 12 phase-locked loops (PLLs).
The following shows the main sections in the Stratix Device Family Data
Sheet:
Section
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
Logic Array Blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
Logic Elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6
MultiTrack Interconnect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–14
TriMatrix Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–21
Digital Signal Processing Block . . . . . . . . . . . . . . . . . . . . . . . . 2–52
PLLs & Clock Networks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–73
I/O Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–104
High-Speed Differential I/O Support. . . . . . . . . . . . . . . . . . 2–130
Power Sequencing & Hot Socketing . . . . . . . . . . . . . . . . . . . 2–140
IEEE Std. 1149.1 (JTAG) Boundary-Scan Support. . . . . . . . . . 3–1
SignalTap II Embedded Logic Analyzer . . . . . . . . . . . . . . . . . 3–5
Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
Temperature Sensing Diode. . . . . . . . . . . . . . . . . . . . . . . . . . . 3–13
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–17
Timing Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–19
Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Device Pin-Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1
®
family of FPGAs is based on a 1.5-V, 0.13-µm, all-layer copper
1. Introduction
Page
1–1