XA3S400A-4FGG400Q Xilinx Inc, XA3S400A-4FGG400Q Datasheet - Page 6

IC FPGA SPARTAN-3A 400K 400-FBGA

XA3S400A-4FGG400Q

Manufacturer Part Number
XA3S400A-4FGG400Q
Description
IC FPGA SPARTAN-3A 400K 400-FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3A XAr
Datasheet

Specifications of XA3S400A-4FGG400Q

Number Of Logic Elements/cells
8064
Number Of Labs/clbs
896
Total Ram Bits
368640
Number Of I /o
311
Number Of Gates
400000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Package / Case
400-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XA3S400A-4FGG400Q
Manufacturer:
XilinxInc
Quantity:
3 000
Part Number:
XA3S400A-4FGG400Q
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XA3S400A-4FGG400Q
Manufacturer:
XILINX
0
Part Number:
XA3S400A-4FGG400Q
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Notes:
1.
DC Electrical Characteristics
All parameter limits are representative of worst-case supply
voltage and junction temperature conditions. Unless
otherwise noted, the published parameter values apply
to all XA Spartan-3A devices, and AC and DC
characteristics are specified using the same numbers
for both I-Grade and Q-Grade.
Table 4: Absolute Maximum Ratings
6
Notes:
1.
XA3S200A
XA3S400A
XA3S700A
XA3S1400A
Symbol
V
V
V
Device
V
V
T
CCAUX
CCINT
V
The XA Spartan-3A FPGA product line is available in -4 Speed Grade only.
CCO
T
STG
For soldering guidelines, see UG112: Device Packaging and Thermal Characteristics and XAPP427: Implementation and Solder Reflow
Guidelines for Pb-Free Packages.
REF
ESD
IN
J
Internal supply voltage
Auxiliary supply voltage
Output driver supply voltage
Input reference voltage
Voltage applied to all User I/O pins and
Dual-Purpose pins
Voltage applied to all Dedicated pins
Electrostatic Discharge Voltage
Junction temperature
Storage temperature
–4 Standard
Performance
Speed Grade
Description
FTG256
FGG400
FGG484
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) I I-Grade (–40°C to 100°C)
400-ball Fine-Pitch Ball Grid Array (FBGA)
484-ball Fine-Pitch Ball Grid Array (FBGA)
Package Type / Number of Pins
Driver in a high-impedance state
Human body model
Charged device model
Machine model
www.xilinx.com
Absolute Maximum Ratings
Stresses beyond those listed under
Maximum Ratings may cause permanent damage to the
device. These are stress ratings only; functional operation
of the device at these or any other conditions beyond those
listed under the Recommended Operating Conditions is not
implied. Exposure to absolute maximum conditions for
extended periods of time adversely affects device reliability.
Conditions
–0.95
–0.5
–0.5
–0.5
–0.5
–0.5
Min
–65
DS681 (v1.1) February 3, 2009
Q Q-Grade (–40°C to 125°C)
Temperature Range ( T
Table
V
Product Specification
CCO
±
±
±
Max
1.32
3.75
3.75
125
150
4.6
4.6
2000
500
200
4: Absolute
+ 0.5
Units
°C
°C
V
V
V
V
V
V
V
V
V
J
)
R

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