XCV812E-8FG900C Xilinx Inc, XCV812E-8FG900C Datasheet - Page 104

• Manufacturer Part Number: XCV812E-8FG900C
• Description: IC FPGA 1.8V C-TEMP 900-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-E EMr

Specifications of XCV812E-8FG900C

• Number Of Logic Elements/cells: 21168
• Number Of Labs/clbs: 4704
• Total Ram Bits: 1146880
• Number Of I /o: 556
• Number Of Gates: 254016
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 900-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
Table 5:
Module 4 of 4
28
Bank
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
FG900 Fine-Pitch BGA Package — XCV812E
IO_DOUT_BUSY_L70P_YY
IO_DIN_D0_L70N_YY
IO_WRITE_L69N_YY
IO_VREF_L63P_YY
IO_VREF_L76P_Y
IO_CS_L69P_YY
IO_L63N_YY
IO_L64N_YY
IO_L64P_YY
Description
IO_L66N_Y
IO_L67N_Y
IO_L72N_Y
IO_L66P_Y
IO_L67P_Y
IO_L72P_Y
IO_L62P
IO_L73P
IO_L73N
IO_L75P
IO_L75N
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
G23
M23
G25
A26
B26
K20
D25
B27
A27
K21
C27
D28
H25
K28
K30
N20
N23
R27
R28
R30
E25
E28
C30
D30
F24
F27
E27
L21
Pin
J21
J25
J28
J22
J23
www.xilinx.com
1-800-255-7778
Table 5:
Bank
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_L80P_YY
IO_VREF_L94P_Y
IO_VREF_L84P
IO_L77N_YY
IO_L80N_YY
IO_L81N_YY
IO_L95N_YY
IO_L77P_YY
IO_L81P_YY
IO_D1_L88P
IO_D2_L88N
IO_L95P_YY
Description
IO_L76N_Y
IO_L82P_Y
IO_L82N_Y
IO_L90P_Y
IO_L90N_Y
IO_L94N_Y
IO_VREF
IO_L78P
IO_L78N
IO_L79P
IO_L79N
IO_L83P
IO_L83N
IO_L84N
IO_L86P
IO_L86N
IO_L91P
IO_L91N
IO_L93P
IO_L93N
IO_L96P
IO_L96N
DS025-4 (v1.6) July 17, 2002
M21
M22
M27
M26
M29
M30
G28
E30
G27
E29
K23
H26
H27
G29
G30
H30
K24
K29
N21
K25
N29
F28
F30
Pin
L22
J24
J26
L23
J29
J30
L24
L27
L26
L28
L30
R