MPC8245LZU266D Freescale Semiconductor, MPC8245LZU266D Datasheet - Page 53

• Manufacturer Part Number: MPC8245LZU266D
• Description: IC MPU 32BIT 266MHZ 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8245LZU266D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 266MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 266MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 1.7V To 2.1V
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

7.8.2
A thermal interface material placed between the top of the package and the bottom of the heat sink
minimizes thermal contact resistance. For applications that attach the heat sink by a spring clip
mechanism,
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. Thermal grease significantly reduces the interface thermal resistance. That is, the bare joint
offers a thermal resistance approximately seven times greater than the thermal grease joint.
A spring clip attaches heat sinks to holes in the printed-circuit board (see
grease offers the best thermal performance, considering the low interface pressure. The selection of any
thermal interface material depends on factors such as thermal performance requirements,
manufacturability, service temperature, dielectric properties, and cost.
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
are selected on the basis of high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials
are provided by the following vendors:
Freescale Semiconductor
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Adhesives and Thermal Interface Materials
Figure 30
1.5
0.5
2
1
0
Figure 30. Thermal Performance of Select Thermal Interface Material
0
shows the thermal performance of three thin-sheet thermal-interface materials
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
10
20
Contact Pressure (psi)
30
40
781-935-4850
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
Figure
70
30). Therefore, synthetic
80
System Design
53