MC7447ATHX1000NB Freescale Semiconductor, MC7447ATHX1000NB Datasheet - Page 48

• Manufacturer Part Number: MC7447ATHX1000NB
• Description: IC MPU RISC 1000MHZ 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7447ATHX1000NB

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.0GHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

System Design Information
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, and so on.
Due to the complexity and variety of system-level boundary conditions for today's microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction)
may vary widely. For these reasons, we recommend using conjugate heat transfer models for the board, as
well as system-level designs.
For system thermal modeling, the MPC7447A thermal model is shown in
represent this device. Two of the volumes, solder ball-air and substrate, are modeled using the package
outline size of the package. The other two, die and bump-underfill, have the same size as the die. The
silicon die should be modeled 8.5 × 9.9 × 0.7 mm
bottom of the volume. The bump and underfill layer is modeled as 8.5 × 9.9 × 0.07 mm
volume) with orthotropic material properties: 0.6 W/(m • K) in the xy-plane and 1.9 W/(m • K) in the
direction of the z-axis. The substrate volume is 25 × 25 × 1.2 mm
conductivity in the xy-plane and 4 W/(m • K) in the direction of the z-axis. The solder ball and air layer
are modeled with the same horizontal dimensions as the substrate and are 0.6 mm thick. They can also be
modeled as a collapsed volume using orthotropic material properties: 0.034 W/(m • K) in the xy-plane
direction and 3.8 W/(m • K) in the direction of the z-axis.
48
Conductivity
Bump and Underfill (8.5 × 9.9 × 0.07 mm
Solder Ball and Air (25 × 25 × 0.6 mm 3 )
k
k
k
k
k
k
k
k
k
x
y
z
x
y
z
x
y
z
Substrate (25 × 25 × 1.2 mm
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Figure 24. Recommended Thermal Model of MPC7447A
Value
0.034
0.034
0.6
0.6
1.9
8.1
8.1
4.0
3.8
3
)
W/(m • K)
3
3
)
Unit
with the heat source applied as a uniform source at the
y
z
3
, and has 8.1 W/(m • K) isotropic
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
Figure
Bump and Underfill
Solder and Air
Substrate
Substrate
Die
24. Four volumes
Die
Freescale Semiconductor
3
(or as a collapsed