SB80L186EB13 Intel, SB80L186EB13 Datasheet - Page 22
SB80L186EB13
Manufacturer Part Number
SB80L186EB13
Description
IC MPU 16-BIT 3V 13MHZ 80-SQFP
Manufacturer
Intel
Datasheet
1.SB80L186EB13.pdf
(59 pages)
Specifications of SB80L186EB13
Rohs Status
RoHS non-compliant
Processor Type
80L186
Features
EB suffix, 16-Bit, Extended Temp
Speed
13MHz
Voltage
3V
Mounting Type
Surface Mount
Package / Case
80-SQFP
Other names
808880
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80C186EB 80C188EB 80L186EB 80L188EB
PACKAGE THERMAL
SPECIFICATIONS
The 80C186EB 80L186EB is specified for operation
when T
of
any environment to determine whether the proces-
sor is within the specified operating range The case
temperature must be measured at the center of the
top surface
22
a
114 C (QFP package) T
b
40 C to
C
(the case temperature) is within the range
a
100 C (PLCC package) or
Table 10 Thermal Resistance (
CA
CA
CA
C
(PLCC)
(QFP)
(SQFP)
may be measured in
b
40 C to
(0) (1 01) (2 03) (3 04) (4 06) (5 07)
30
58
70
0
Airflow Linear ft min (m sec)
TBD
200
24
47
CA
) at Various Airflows (in C Watt)
TBD
T
from
ent) with the following equation
Typical values for
in Table 10 P (the maximum power consumption
specified in watts) is calculated by using the maxi-
mum ICC as tabulated in the DC specifications and
V
400
21
43
A
CC
(the ambient temperature) can be calculated
of 5 5V
CA
TBD
600
19
40
(thermal resistance from the case to ambi-
TBD
800
17
38
T
A
CA
e
1000
TBD
16 5
36
T
at various airflows are given
C
b
P
CA
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