MPC8245LVV300D Freescale Semiconductor, MPC8245LVV300D Datasheet - Page 58

• Manufacturer Part Number: MPC8245LVV300D
• Description: IC MPU 32BIT 300MHZ PPC 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerPCr

Specifications of MPC8245LVV300D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 300MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Maximum Clock Frequency: 300 MHz
• Operating Supply Voltage: 1.8 V, 1.9 V, 2 V, 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 300MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 352
• Supply Voltage Range: 1.7V To 2.1V
• Operating Temperature Range: 0°C To +105°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Document Revision History
58
Revision
0.5
2
1
Date
—
—
—
Globally changed EPIC to PIC.
Section 1.4.1.4—Note 5: Changed register reference from 0x72 to 0x73.
Section 1.4.1.5—Table 5: Updated power dissipation numbers based on latest characterization data.
Section 1.4.2—Table 6: Updated table to show more thermal specifications.
Section 1.4.3—Table 7: Updated minimum memory bus value to 50 MHz.
Section 1.4.3.1—Changed equations for DLL locking range based on characterization data. Added
updates and reference to AN2164 for note 6. Added table defining Tdp parameters. Labeled N value
in Figures 5 through 8.
Section 1.4.3.2—Table 10: Changed bit definitions for tap points. Updated note on Tos and added
reference to AN2164 for note 7. Updated Figure 9 to show significance of Tos.
Section 1.4.3.4—Added column for SDRAM_CLK @ 133 MHz
Sections 1.5.1 and 1.5.2—Corrected packaging information to state TBGA packaging.
Section 1.5.3—Corrected some signals in Table 16 which were missing overbars in the Rev 1.0
release of the document.
Section 1.6—Updated Note 10 of Tables 18 and 19.
Section 1.7.3—Changed sentence recommendation regarding decoupling capacitors.
Section 1.9—Updated format of tables in Ordering Information section.
Updated document template.
Section 1.4.1.4—Changed the driver type names in Table 6 to match with the names used in the
MPC8245 Reference Manual.
Section 1.5.3—Updated driver type names for signals in Table 16 to match with names used in the
MPC8245 Integrated Processor Reference Manual.
Section 1.4.1.2—Updated Table 7 to refer to new PLL Tables for VCO limits.
Section 1.4.3.3—Added item 12e to Table 10 for SDRAM_SYNC_IN to Output Valid timing.
Section 1.5.1—Updated solder balls information to 62Sn/36PB/2Ag.
Section 1.6—Updated PLL Tables 17 and 18 and appropriate notes to reflect changes of VCO ranges
for memory and CPU frequencies.
Section 1.7—Updated voltage sequencing requirements in Table 2 and removed Section 1.7.2.
Section 1.7.8—Updated TRST information and Figure 26.
New Section 1.7.2—Updated the range of I/O power consumption numbers for OV
correct values as in Table 5. Updated fastest frequency combination to 66:100:350 MHz.
Section 1.7.9—Updated list for heat sink and thermal interface vendors.
Section 1.9—Changed format of Ordering Information section. Added tables to reflect part number
specifications also available.
Added Sections 1.9.2 and 1.9.3.
Corrected labels for Figures 5 through 8.
MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Table 19. Revision History Table (continued)
Substantive Change(s)
Freescale Semiconductor
DD
and GV
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to