MPC8270CVRMIBA Freescale Semiconductor, MPC8270CVRMIBA Datasheet - Page 43

• Manufacturer Part Number: MPC8270CVRMIBA
• Description: IC MPU POWERQUICC II 516-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8270CVRMIBA

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 266MHz
• Voltage: 1.5V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 266 MHz
• Operating Supply Voltage: 0 V to 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 3.3 V
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: 0 C
• Program Memory Size: 16 KB
• Program Memory Type: EPROM/Flash
• Core Size: 32 Bit
• Cpu Speed: 266MHz
• Embedded Interface Type: I2C, JTAG, SPI, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 516
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 14
Table 21
Table
Freescale Semiconductor
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
21.
shows the pinout list of the MPC8280 and MPC8270.
shows the side profile of the TBGA package to indicate the direction of the top surface view.
MPC8280/MPC8270
Soldermask
1.27 mm Pitch
Polymide Tape
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
(Oxidized for Insulation)
Copper Heat Spreader
Figure 14. Side View of the TBGA Package
Pin Name
Glob-Top Dam
MPC8280 only
Glob-Top Filled Area
View
Die
Table 22
Wire Bonds
Attach
Die
defines conventions and acronyms used in
Copper Traces
Cavity
Etched
Pressure Sensitive
Adhesive
Ball
W5
G1
H5
H2
H1
F4
E2
E3
K4
K3
K2
K1
J5
J4
J3
J2
J1
L5
L4
L3
L2
Pinout
43