MPC8349VVAGDB Freescale Semiconductor, MPC8349VVAGDB Datasheet - Page 55

IC MPU POWERQUICC II 672-TBGA

MPC8349VVAGDB

Manufacturer Part Number
MPC8349VVAGDB
Description
IC MPU POWERQUICC II 672-TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8349VVAGDB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
672-TBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8349E-MITXE
Maximum Clock Frequency
400 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
400MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2V
Operating Supply Voltage (max)
1.26V
Operating Supply Voltage (min)
1.14V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
672
Package Type
TBGA
For Use With
MPC8349E-MITX-GP - KIT REFERENCE PLATFORM MPC8349EMPC8349E-MITXE - BOARD REFERENCE FOR MPC8349MPC8349EA-MDS-PB - KIT MODULAR DEV SYSTEM MPC8349E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8349VVAGDB
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MPC8349VVAGDB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
18.2
Figure 39
672-TBGA package.
Freescale Semiconductor
Figure 39. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8349EA TBGA
Mechanical Dimensions for the MPC8349EA TBGA
shows the mechanical dimensions and bottom surface nomenclature for the MPC8349EA,
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement must exclude any effect of mark on top surface of package.
Package and Pin Listings
55

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