MPC870CZT66 Freescale Semiconductor, MPC870CZT66 Datasheet - Page 10

• Manufacturer Part Number: MPC870CZT66
• Description: IC MPU POWERQUICC 66MHZ 256PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC870CZT66

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 66MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Thermal Characteristics
1
This device contains circuitry protecting against damage due to high-static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for example, either GND or V
4
Table 4
1
2
3
4
5
6
10
Temperature
Temperature (extended)
Junction-to-ambient
Junction-to-board
Junction-to-case
Junction-to-package top
Minimum temperatures are guaranteed as ambient temperature, T
temperature, T
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages where
the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to the
exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
Thermal Characteristics
shows the thermal characteristics for the MPC875/MPC870.
1
Rating
(standard)
J
5
.
4
1
6
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Table 4. MPC875/MPC870 Thermal Resistance Data
Natural convection
Airflow (200 ft/min)
Natural convection
Airflow (200 ft/min)
Rating
Table 3. Operating Temperatures
Environment
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
A
. Maximum temperatures are guaranteed as junction
Symbol
T
T
T
T
A(min)
J(max)
A(min)
J(max)
Symbol
R
R
R
R
R
R
θJMA
θJMA
θJMA
Ψ
Ψ
θJA
θJC
θJB
JT
JT
DDH
2
3
3
3
Freescale Semiconductor
).
Value
Value
–40
100
95
0
43
29
36
26
20
10
2
2
°C/W
Unit
Unit
°C
°C
°C
°C