MPC859DSLZP66A Freescale Semiconductor, MPC859DSLZP66A Datasheet - Page 92

• Manufacturer Part Number: MPC859DSLZP66A
• Description: IC MPU POWERQUICC 66MHZ 357PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC859DSLZP66A

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 66MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Mechanical Data and Ordering Information
15.2 Mechanical Dimensions of the PBGA Package
For more information on the printed-circuit board layout of the PBGA package, including thermal via design and
suggested pad layout, please refer to Plastic Ball Grid Array Application Note (order number: AN1231/D) available
from your local Freescale sales office.
Figure 79
shows the mechanical dimensions of the PBGA package.
Note: Solder sphere composition for MPC866XZP, MPC859PZP, MPC859DSLZP, and MPC859TZP
is 62%Sn 36%Pb 2%Ag
Figure 79. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
MPC866/MPC859 Hardware Specifications, Rev. 2
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Freescale Semiconductor