MPC755CPX400LE Freescale Semiconductor, MPC755CPX400LE Datasheet - Page 33

IC MPU PPC 400MHZ 360-FCPBGA

MPC755CPX400LE

Manufacturer Part Number
MPC755CPX400LE
Description
IC MPU PPC 400MHZ 360-FCPBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC755CPX400LE

Processor Type
MPC7xx PowerPC 32-Bit
Speed
400MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
360-FCPBGA
Family Name
MPC7xx
Device Core
PowerPC
Device Core Size
64b
Frequency (max)
400MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2V
Operating Supply Voltage (max)
2.1V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
360
Package Type
FCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC755CPX400LE
Manufacturer:
LT
Quantity:
550
Part Number:
MPC755CPX400LE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC755CPX400LER2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
7.1
The package parameters are as provided in the following list. The package type is 21 × 21 mm, 255-lead
plastic ball grid array (PBGA).
7.2
Figure 18
255 PBGA package.
Freescale Semiconductor
2X
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter (typical)
A1 CORNER
0.2
e
Package Parameters for the MPC745 PBGA
Mechanical Dimensions for the MPC745 PBGA
Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC745,
provides the mechanical dimensions and bottom surface nomenclature for the MPC745,
E
B
E1
1 2 3 4 5 6 7 8 9 10 111213141516
255X
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
b
D1
D
0.15
0.3
255 (16 × 16 ball array – 1)
1.27 mm (50 mil)
2.25 mm
2.80 mm
21 × 21 mm
0.75 mm (29.5 mil)
M
T
R
P
N
L
K
H
G
F
E
D
C
B
A
J
C
C
255 PBGA Package
A
B
0.2
A
0.2 C
A
A3
A2
A1
C
NOTES:
1. DIMENSIONING AND TOLERANCING
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
4. CAPACITOR PADS MAY BE
PER ASME Y14.5M, 1994.
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
UNPOPULATED.
DIM
A1
A2
A3
D1
E1
A
D
E
b
e
2.25
0.50
1.00
0.60
Min
Millimeters
21.00 BSC
21.00 BSC
1.27 BSC
6.75
7.87
Package Description
Max
2.80
0.70
1.20
0.60
0.90
33

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